Accurate electromagnetic (EM) analysis for interconnect structures of integrated circuits is challenging because multicomponent materials and multiscale geometry coexist and they will greatly deteriorate the conditioning of system matrix in the integral equation approach. We use the volume-surface integral equations (VSIEs) to describe the problem and develop a mixed method to solve the VSIEs. The involved volume integral equations (VIEs) can improve the conditioning of system matrix, whereas the mixed method can remove the dependence of material parameters in the integral kernel of VIEs. The approach is demonstrated by two numerical examples and its good performance has been validated.

中文翻译：

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基于混合方法的互连结构精确电磁分析

集成电路互连结构的精确电磁 (EM) 分析具有挑战性，因为多组分材料和多尺度几何结构共存，它们将大大恶化积分方程方法中系统矩阵的条件。我们使用体积表面积分方程 (VSIE) 来描述问题并开发一种混合方法来解决 VSIE。所涉及的体积积分方程（VIE）可以改善系统矩阵的条件，而混合方法可以消除VIE积分核中材料参数的依赖性。该方法通过两个数值例子进行了证明，其良好的性能已经得到验证。