Abstract In order to exploit the aluminum potential in industrial environments, the application of alloying is fundamental. Anyway, this entails drawbacks such as decrement of mechanical bulk properties and corrosion phenomena. The surface engineering, and particularly the surface coatings, allows the local modification of the samples properties to overtake these criticisms. Copper it is often applied as a viable alternative to aluminum in several applications. Indeed, combinations of both have already broadly exploited for functional components. However, surface pretreatments strictly affect the production of coatings. This article proposes a study on the effects of some of the pretreatments of major industrial interest on the deposits created through the electrodeposition process. The results achieved demonstrate how the samples preparation effectively affects the growth of the copper grain as well as the coatings performance. In fact, different grains morphologies were observed as well as different performance of the coatings in terms of wear and scratch resistance. In particular, smooth and extremely corrugated surfaces did not lead to the formation of a continuous copper coatings when low thickness is considered. To bridge the gap among several grains, the copper core deposited has a planar growth in opposition to the other pretreatment, which allowed a compact coating and a columnar growth. Furthermore, the larger are the grain the less adherent is the coating. Also, different breakage mechanisms were identified as a function of the coating thickness.

中文翻译：

---

预处理对铜涂层力学和形态特征的影响

摘要 为了开发铝在工业环境中的潜力，合金化的应用是基础。无论如何，这会带来一些缺点，例如机械整体性能下降和腐蚀现象。表面工程，尤其是表面涂层，允许对样品特性进行局部修改以克服这些批评。铜 在多种应用中，它通常被用作铝的可行替代品。事实上，两者的组合已经广泛用于功能组件。然而，表面预处理严格影响涂层的生产。本文提出了一项关于主要工业利益的一些预处理对通过电沉积过程产生的沉积物的影响的研究。获得的结果表明样品制备如何有效地影响铜晶粒的生长以及涂层性能。事实上，观察到不同的晶粒形态以及涂层在耐磨性和抗划伤性方面的不同性能。特别是，当考虑低厚度时，光滑和极度波纹的表面不会导致形成连续的铜涂层。为了弥合几个晶粒之间的间隙，沉积的铜芯具有与其他预处理相反的平面生长，这允许致密的涂层和柱状生长。此外，颗粒越大，涂层的附着力越小。此外，不同的破损机制被确定为涂层厚度的函数。