The oriented graphene could construct an effective heat transfer path in composites with low filler loading. However, electrical conductivity and hygroscopicity caused by functionalized graphene has been ignored, which would decay the lifetime of power devices with the composites as thermal managing materials. In this work, SiC nanowires with high thermal conductivity and hydrophobicity were introduced into vertically oriented multilayer graphene in epoxy resin, constructing an effectively thermally conductive structure. In the structure, multilayer graphene coated with magnetic iron oxide particles responded to external magnetic field, which dramatically reduced the multilayer graphene loading in epoxy resin. When the fillers were rearranged by the magnetic field, the thermal conductivity of the composites reached 0.708 W/(mK), an enhancement of 311.6% compared to epoxy resin. Furthermore, SiC nanowires also damped the electrical conductivity (1.54 × 10⁻¹³ S/cm) and hygroscopicity of epoxy composites. The design made it possible for the composites to be applied to electronic packaging field.

取向石墨烯可以在低填料含量的复合材料中构建有效的传热路径。但是，由功能化石墨烯引起的电导率和吸湿性已被忽略，这会降低以复合材料作为热管理材料的功率器件的寿命。在这项工作中，具有高导热性和疏水性的SiC纳米线被引入到环氧树脂中垂直取向的多层石墨烯中，从而构建了有效的导热结构。在该结构中，涂有磁性氧化铁颗粒的多层石墨烯响应外部磁场，从而大大降低了环氧树脂中多层石墨烯的负载。当填料通过磁场重新排列后，复合材料的导热系数达到0.708 W /（mK），与环氧树脂相比，提高了311.6％。此外，SiC纳米线还抑制了电导率（1.54×10^-13 S / cm）和环氧复合材料的吸湿性。该设计使得复合材料可以应用于电子包装领域。