The adsorption behavior of glycerol, erythritol, xylitol and glucose on copper surface was investigated via molecular dynamics simulation, in order to predict the effect of additive on throwing power of copper pyrophosphate bath, and then the electrochemical analysis was conducted to verify this prediction. The experimental data supported the simulation result, i.e., the pyrophosphate bath in presence of glycerol has the best throwing power. It is demonstrated that the molecular dynamics simulation is a promising tool with good accuracy for the additive screening in electroplating process.

中文翻译：

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通过分子动力学模拟筛选可提高焦磷酸铜镀液投掷能力的电镀添加剂

通过分子动力学模拟研究了甘油，赤藓糖醇，木糖醇和葡萄糖在铜表面的吸附行为，以预测添加剂对焦磷酸铜浴投掷能力的影响，然后进行电化学分析以验证这一预测。实验数据支持了模拟结果，即在甘油存在下的焦磷酸盐浴具有最佳的投掷力。结果表明，分子动力学模拟是一种有前途的工具，具有良好的准确性，可用于电镀过程中的添加剂筛选。