Glass is a promising interposer substrate for 2.5 D integration; yet detailed analysis of the interfacial reliability of through-glass vias (TGVs) has been lacking. The purpose of this paper is to investigate the design and material factors responsible for the interfacial delamination in TGVs and identify methods to improve reliability.,The interfacial reliability of TGVs is studied both analytically and numerically. An analytical solution is presented to show the dependence of the energy release rate (ERR) for interfacial delamination on the via design and the thermal mismatch strain. Then, finite element analysis (FEA) is used to investigate the influence of detailed design and material factors, including the pitch distance, via aspect ratio, via geometry and the glass and via materials, on the susceptibility to interfacial delamination.,ERR for interfacial delamination is directly proportional to the via diameter and the thermal mismatch strain. Thinner wafers with smaller aspect ratios show larger ERRs. Changing the via geometry from a fully filled via to an annular via leads to lower ERR. FEA results also show that certain material combinations have lower thermal mismatch strains, thus less prone to delamination.,The results and approach presented in this paper can guide the design and development of more reliable 2.5 D glass interposers.,This paper represents the first attempt to comprehensively evaluate the impact of design and material selection on the interfacial reliability of TGVs.

中文翻译：

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2.5D集成电路玻璃通孔的界面可靠性

玻璃是用于 2.5 D 集成的有前途的中介层基板；然而，一直缺乏对玻璃通孔 (TGV) 界面可靠性的详细分析。本文的目的是研究导致 TGV 界面分层的设计和材料因素，并确定提高可靠性的方法。从分析和数值两方面研究了 TGV 的界面可靠性。提出了一种解析解，以显示界面分层的能量释放率 (ERR) 对通孔设计和热失配应变的依赖性。然后，使用有限元分析 (FEA) 来研究详细设计和材料因素对界面分层敏感性的影响，包括节距、通孔纵横比、通孔几何形状以及玻璃和通孔材料。界面分层的 ERR 与通孔直径和热失配应变成正比。具有较小纵横比的较薄晶片显示较大的 ERR。将通孔几何形状从完全填充通孔更改为环形通孔可降低 ERR。FEA 结果还表明，某些材料组合具有更低的热失配应变，因此更不容易分层。,本文提出的结果和方法可以指导更可靠的 2.5 D 玻璃中介层的设计和开发。,本文代表了首次尝试综合评估设计和材料选择对TGVs界面可靠性的影响。将通孔几何形状从完全填充通孔更改为环形通孔可降低 ERR。FEA 结果还表明，某些材料组合具有更低的热失配应变，因此更不容易分层。,本文提出的结果和方法可以指导更可靠的 2.5 D 玻璃中介层的设计和开发。,本文代表了首次尝试综合评估设计和材料选择对TGV界面可靠性的影响。将通孔几何形状从完全填充通孔更改为环形通孔可降低 ERR。FEA 结果还表明，某些材料组合具有更低的热失配应变，因此更不容易分层。,本文提出的结果和方法可以指导更可靠的 2.5 D 玻璃中介层的设计和开发。,本文代表了首次尝试综合评估设计和材料选择对TGVs界面可靠性的影响。