A low-profile and high-gain Gaussian beam antenna (GBA) operating at 1 THz is demonstrated for the first time. Imprint and dry etching technologies in silicon are employed. A complementary antenna feed based on the magnetoelectric dipole is proposed for enhancing the radiation characteristics of the antenna. The microfabrication technologies are compatible with the Si-based integrated circuit manufacturing process. The terahertz (THz) antenna is realized with over 20 dBi in antenna gain. With high-precision fabrication technologies, a highly efficient THz GBA with smooth morphology and much lower profile than conventional horn and lens antennas is developed. Moreover, the antenna has the characteristic of low sidelobe levels which is advantageous in many wireless applications.

中文翻译：

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用于超高速无线通信的紧凑型高增益硅印迹太赫兹天线

首次展示了工作在 1 THz 的低剖面高增益高斯波束天线 (GBA)。在硅中采用压印和干蚀刻技术。为了提高天线的辐射特性，提出了一种基于磁电偶极子的互补天线馈源。微制造技术与硅基集成电路制造工艺兼容。太赫兹 (THz) 天线实现了超过 20 dBi 的天线增益。借助高精度制造技术，开发出一种高效的太赫兹 GBA，其形态光滑，并且比传统的喇叭和透镜天线低得多。此外，该天线具有低旁瓣电平的特性，这在许多无线应用中是有利的。