The TIMESPOT project aims at the construction of a mini-tracker demonstrator implementing both high space and time resolutions at the single pixel level. The pixels have a pitch of 55 × 55 $\mathrm{\mu }$m². Specified time resolution is equal or better than 50 ps. Developed sensors are based both on 3D silicon and diamond technologies, whose layout and fabrication process have been suitably optimized for best time resolution. Read-out pixel electronics is being developed in 28-nm CMOS technology. The first batch of 3D silicon sensors, containing several test structures based on different geometries of the electrodes, has been delivered in June 2019 and has been tested against its timing performance both under laser and minimum ionizing particle beams. In the present paper, the output of these starting measurements is presented. The sensors show very good timing performance, having $\sigma$¡30 ps (sigma), although operated with non-optimized front-end electronics and in noisy environment. These results represent an important step forward in the development of pixels with timing operating at extremely high interaction rates and fluences, as required in the next generation of upgraded colliders.

TIMESPOT项目旨在构建一个微型跟踪器演示器，该演示器在单个像素级别实现高空间分辨率和时间分辨率。像素的间距为55×55$\mathrm{\mu }$m ²。指定的时间分辨率等于或大于50 ps。研发的传感器均基于3D硅技术和钻石技术，它们的布局和制造过程已经过适当优化，以实现最佳时间分辨率。读出像素电子设备正在采用28纳米CMOS技术开发。首批3D硅传感器包含基于电极不同几何形状的几种测试结构，已于2019年6月交付，并针对其在激光和最小电离粒子束下的定时性能进行了测试。在本文中，介绍了这些初始测量的输出。传感器显示出非常好的计时性能，$\sigma$尽管使用未优化的前端电子设备并且在嘈杂的环境中运行，但仍为¡30 ps（sigma）。这些结果代表了像素开发的重要一步，其时序以下一代升级对撞机的要求以极高的交互速率和注量运行。