Abstract In order to solve the segregation and discontinuous precipitation of Cu–Ni–Sn alloys and explore the influence mechanism of solid soluble microelements on the microstructure and properties. Herein, based on the cluster-plus-glue-atom model, Zn or Co, with different solubilities in Cu, was selected as the fourth element in the way of replacing a small portion of Sn for the composition design of Cu–Ni–Sn–Zn (Co) series alloys. The solid solution forms and positions of Zn and Co solutes were revealed according to EPMA composition analysis and variation of the lattice parameter of the Cu matrix in solution treated alloys, and form atomic site occupation point of view, the influence of Zn or Co on solidus-liquidus temperature range were discussed. Furthermore, phase transformation and resistivity thermal stability with temperature rising were investigated and discussed utilizing results of variable temperature resistance. These results show that Zn solutes dissolve in the form of clusters, resulting in a strong solid solution strengthening, existing less effect on conductivity, and increasing comprehensive properties after long-term aging, which indicates that Zn can be a good candidate for the multi-component design of Cu–Ni–Sn alloys. These findings may offer new insights on composition optimization of Cu–Ni–Sn alloy.

中文翻译：

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Zn和Co溶质对Cu-Ni-Sn合金性能的不同影响

摘要 为解决Cu-Ni-Sn合金的偏析和不连续析出，探索固溶微量元素对显微组织和性能的影响机制。在此，基于簇加胶原子模型，选择在 Cu 中具有不同溶解度的 Zn 或 Co 作为第四种元素，以替代一小部分 Sn 的方式进行 Cu-Ni-Sn 的成分设计–Zn (Co) 系列合金。根据EPMA成分分析和固溶处理合金中Cu基体晶格参数的变化，揭示了Zn和Co溶质的固溶形式和位置，并从形成原子位点的角度，Zn或Co对固相线的影响-液相线温度范围进行了讨论。此外，利用变温电阻的结果，研究和讨论了随温度升高的相变和电阻率热稳定性。这些结果表明，Zn 溶质以团簇形式溶解，固溶强化作用强，对电导率的影响较小，长期时效后综合性能提高，表明 Zn 是一种很好的复合材料。 Cu-Ni-Sn合金的组件设计。这些发现可能为 Cu-Ni-Sn 合金的成分优化提供新的见解。长期时效后综合性能提高，这表明 Zn 可以成为 Cu-Ni-Sn 合金多组分设计的良好候选者。这些发现可能为 Cu-Ni-Sn 合金的成分优化提供新的见解。长期时效后综合性能提高，这表明 Zn 可以成为 Cu-Ni-Sn 合金多组分设计的良好候选者。这些发现可能为 Cu-Ni-Sn 合金的成分优化提供新的见解。