Cu₂SnSe₃ has been considered as a potential thermoelectric material owing to its cost-effective and nontoxic constituent elements along with its high electrical conductivity. However, its low Seebeck coefficient has been a concern towards realizing a high figure-of-merit. In the present study, Cu₂SnSe₃/xSnSe (x = 0, 5, 10, and 20 wt %) composite samples whose thermoelectric performance has been studied in the temperature range 10–375 K, shows that the Seebeck coefficient of sample containing 10% SnSe is ~3.6 times that of the pure. The incorporation of SnSe has resulted in a significant increase in electrical resistivity and Seebeck coefficient which is attributable to the decrease in carrier concentration with increase in SnSe content. Concurrently, a power factor (PF) of 35.60 μW/mK² has been attained for x = 10% sample at 375 K. However, due to the increase in thermal conductivity with the addition of SnSe, the composites have lower ZT values than that of the pristine Cu₂SnSe₃ sample. Furthermore, the Vicker's microhardness, which is a key measure for the mechanical strength of a material, has distinctly improved by the addition of SnSe.

由于Cu ₂ SnSe ₃具有成本效益，无毒的构成元素以及高电导率，因此被认为是一种潜在的热电材料。然而，其低塞贝克系数一直是实现高品质因数的关注点。在本研究中，Cu ₂ SnSe ₃ / x SnSe（x = 0、5、10和20 wt％的复合样品的热电性能已在10–375 K的温度范围内进行了研究，结果表明，含10％SnSe的样品的塞贝克系数约为纯样品的3.6倍。SnSe的掺入导致电阻率和塞贝克系数的显着增加，这归因于载流子浓度随SnSe含量的增加而降低。同时，功率因数（PF）的35.60μW/ mK的²已经达到了X 在375 K. = 10％样品然而，由于在通过添加位SnSe的热传导率的增加，复合材料具有较低的ZT值比Cu ₂ SnSe _3的含量样品。此外，通过添加SnSe可以显着改善维氏显微硬度，这是衡量材料机械强度的关键指标。