Abstract We investigated the leaching of copper with Phanerochaete chrysosporium (P. chrysosporium) from waste printed circuit boards (WPCBs). Leaching of copper after treatment with P. chrysosporium for 14 days was 60.96%, which was 9 times higher than that in absence of the fungi. After 14 days of treatment with fungi, the copper clad laminates of printed circuit boards were seriously corroded without any metallic luster with the corresponding color change from yellow to reddish-brown. An oxidation layer was formed on the surface of the copper clad laminate. It consisted of copper, cupric oxide (CuO), cuprous oxide (Cu2O), and mycelia. The leaching of copper by P. chrysosporium is a result of the combined effect of the bio-enzymes and organic acids. Bio-enzymes, such as laccase (Lac), manganese peroxidase (MnP), and lignin peroxidase (LiP), attacked the chemical bonds in the copper crystal using the generated free radicals. Organic acids, such as oxalic acid, gluconic acid, and citric acid, leached copper because of the H+ ions produced due to acidolysis. In addition, the organic acids also influenced the leaching of copper indirectly by changing the pH of the leaching system.

中文翻译：

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使用 Phanerochaete chrysosporium 真菌从废印刷电路板中浸出铜

摘要 我们研究了用 Phanerochaete chrysosporium (P. chrysosporium) 从废印刷电路板 (WPCB) 中浸出铜的情况。用P. chrysosporium处理14天后铜的浸出率为60.96%，是没有真菌处理的9倍。用真菌处理14天后，印制电路板覆铜板被严重腐蚀，没有任何金属光泽，相应的颜色由黄色变为红褐色。覆铜板表面形成氧化层。它由铜、氧化铜 (CuO)、氧化亚铜 (Cu2O) 和菌丝体组成。P. chrysosporium 对铜的浸出是生物酶和有机酸共同作用的结果。生物酶，如漆酶（Lac）、锰过氧化物酶（MnP）和木质素过氧化物酶（LiP），使用产生的自由基攻击铜晶体中的化学键。有机酸，如草酸、葡萄糖酸和柠檬酸，由于酸解产生的 H+ 离子而浸出铜。此外，有机酸还通过改变浸出系统的pH值间接影响铜的浸出。