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Analytical approaches to describe diffusion bonding of similar and dissimilar materials
Science and Technology of Welding and Joining ( IF 3.1 ) Pub Date : 2020-07-28 , DOI: 10.1080/13621718.2020.1796299
Fuhui Zhu 1 , Xifeng Li 1 , Heli Peng 2 , Hongkai Zhao 3 , Liangtong Xiong 3 , Jun Chen 1
Affiliation  

Diffusion bonding is widely used for joining similar or dissimilar materials. It is necessary to develop a suitable approach to describe the variation of the bonding ratio throughout the bonding process. It helps to obtain the processing window based on limited experimental data. The analytical approach was developed to consider the effects of temperature, pressure and holding time on diffusion bonding ratio. The analytical approach of diffusion bonding of similar materials is further extended to that of dissimilar ones. Both approaches were verified by comparing the prediction and experiment data upon bonding ratio. The average absolute relative errors of the approaches of similar and dissimilar materials are 3.80% and 6.28%, respectively. Both approaches indicate good prediction accuracy.

中文翻译:

描述相似和不同材料扩散键合的分析方法

扩散粘合广泛用于连接相似或不同的材料。有必要开发一种合适的方法来描述整个键合过程中键合率的变化。它有助于根据有限的实验数据获得处理窗口。开发分析方法以考虑温度、压力和保持时间对扩散结合率的影响。相似材料扩散键合的分析方法进一步扩展到异种材料的分析方法。这两种方法都通过比较结合率的预测和实验数据来验证。相似和异种材料的方法的平均绝对相对误差分别为3.80%和6.28%。这两种方法都表明了良好的预测准确性。
更新日期:2020-07-28
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