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Effect of alumina impurity on microstructure and properties of alumina based conventionally brazed joints
Indian Journal of Engineering & Materials Sciences Pub Date : 2020-05-11
Nandadulal Dandapat, Sumana Ghosh

Mo-Mn metallization of alumina ceramics of different purity has been performed at 1400 °C for 10 min in moist hydrogen and nitrogen atmosphere. Nickel coating has been applied onto the metallized alumina ceramics at 1000 °C for 1 h in a reducing hydrogen atmosphere. Finally, metallized and nickel coated alumina ceramics has been brazed with another metallized and nickel coated alumina ceramics using CuAg filler alloy at 900 °C for 10 min in a vacuum furnace at 1×10-6 Torr pressure. X-ray diffraction (XRD), scanning electron microscopy (SEM) and energy dispersive X-ray (EDX) analysis has been carried out for phase analysis, microstructural investigation and elemental composition analysis. The adhesive strength of the metallizing layer and brazing strength of the joint have been measured by pull down breaking strength method. SEM study has shown that the width of the interfacial reaction region between the metallizing layer and substrate enhances with increasing the impurity content in the alumina ceramics. It has been observed that the adhesive strength of the metallizing layer depends on the interfacial reaction layer thickness. The adhesive strength of the metallizing layer has been increased with increasing the thickness of interfacial reaction layer. High adhesive strength of the metallizing layer as well as brazing strength has beenachieved for alumina ceramics with high impurity content.

中文翻译:

氧化铝杂质对氧化铝基传统钎焊接头组织和性能的影响

不同纯度的氧化铝陶瓷的Mo-Mn金属化已在1400°C的潮湿氢气和氮气气氛中进行了10分钟。镍涂层已在还原性氢气氛中在1000°C的温度下涂覆到金属化的氧化铝陶瓷上1小时。最后,在1×10-6 Torr压力的真空炉中,使用CuAg填充合金在900°C下将金属化和镀镍的氧化铝陶瓷与另一种金属化和镀镍的氧化铝陶瓷钎焊10分钟。X射线衍射(XRD),扫描电子显微镜(SEM)和能量色散X射线(EDX)分析已用于相分析,微结构研究和元素组成分析。通过下拉断裂强度法测量金属化层的粘合强度和接头的钎焊强度。SEM研究表明,金属化层与基体之间的界面反应区域的宽度随着氧化铝陶瓷中杂质含量的增加而增加。已经观察到,金属化层的粘合强度取决于界面反应层的厚度。随着界面反应层厚度的增加,金属化层的粘合强度已经增加。对于具有高杂质含量的氧化铝陶瓷,已经实现了金属化层的高粘合强度以及钎焊强度。已经观察到,金属化层的粘合强度取决于界面反应层的厚度。随着界面反应层厚度的增加,金属化层的粘合强度已经增加。对于具有高杂质含量的氧化铝陶瓷,已经实现了金属化层的高粘合强度以及钎焊强度。已经观察到,金属化层的粘合强度取决于界面反应层的厚度。随着界面反应层厚度的增加,金属化层的粘合强度已经增加。对于具有高杂质含量的氧化铝陶瓷,已经实现了金属化层的高粘合强度以及钎焊强度。
更新日期:2020-05-11
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