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DEPOSITION OF TiAlV THIN FILMS BY PULSED LASER AND DC MAGNETRON SPUTTERING: STRUCTURAL, COMPOSITIONAL AND ELECTROCHEMICAL CORROSION STUDY
Surface Review and Letters ( IF 1.2 ) Pub Date : 2019-11-13 , DOI: 10.1142/s0218625x19501889
A. ALKHAWWAM 1 , B. ABDALLAH 1 , A. K. JAZMATI 1 , M. TOOTANJI 1 , F. LAHLAH 1
Affiliation  

In this work, TiAlV thin films have been prepared on two different types of substrates: silicon and stainless steel (SS304) by two deposition methods: Pulsed Laser Deposition (PLD) and DC magnetron sputtering. Different techniques have been employed in order to characterize film properties such as: Scanning Electron Microscopy (SEM) equipped with Energy Dispersive X-ray (EDX), X-ray diffraction (XRD), microhardness and corrosion test. EDX analysis showed that the deposited films are slightly different from that of the target material Ti6Al4V alloy. The measured microhardness values are about 11.7[Formula: see text]GPa and 4.7[Formula: see text]GPa for films prepared by PLD and DC magnetron sputtering, respectively. Corrosion test indicated that the corrosion resistance of the two TiAlV films deposited on SS304 substrates in (0.9% NaCl) physiological normal saline medium was significantly improved compared with the SS304 substrates. These attractive results could permit applications of our films in the medical implants fabrication.

中文翻译:

通过脉冲激光和直流磁控溅射沉积 TiAlV 薄膜:结构、成分和电化学腐蚀研究

在这项工作中,通过脉冲激光沉积 (PLD) 和直流磁控溅射两种沉积方法在两种不同类型的基板上制备了 TiAlV 薄膜:硅和不锈钢 (SS304)。已经采用了不同的技术来表征薄膜特性,例如:配备能量色散 X 射线 (EDX)、X 射线衍射 (XRD)、显微硬度和腐蚀测试的扫描电子显微镜 (SEM)。EDX 分析表明,沉积膜与靶材 Ti6Al4V 合金的沉积膜略有不同。对于通过PLD和DC磁控溅射制备的薄膜,测得的显微硬度值分别约为11.7[公式:见正文]GPa和4.7[公式:见正文]GPa。腐蚀试验表明,沉积在SS304衬底上的两层TiAlV薄膜的耐腐蚀性能在(0. 9% NaCl)生理盐水培养基与SS304底物相比有显着改善。这些有吸引力的结果可以允许我们的薄膜在医疗植入物制造中的应用。
更新日期:2019-11-13
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