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Numerical computation of wetting angles of Sn–(3−x)Ag–0.5Cu−x(Bi,In) quaternary Pb-free solder alloy systems on Cu substrate
International Journal of Modern Physics C ( IF 1.5 ) Pub Date : 2020-06-12 , DOI: 10.1142/s0129183120501193
Ahmet Mustafa Erer 1 , Mukaddes Ökten Turacı 2
Affiliation  

This paper was aimed to study of the wetting angle ([Formula: see text]) of Sn–Ag–Cu, Sn–([Formula: see text])Ag–0.5Cu–([Formula: see text])Bi and Sn–([Formula: see text])Ag–0.5Cu–([Formula: see text])In ([Formula: see text], 1 and 2 in wt.%) Pb-free solder alloy systems at various temperatures (250, 280 and 310C) on Cu substrate in Ar atmosphere. The new Sn–([Formula: see text])Ag–0.5Cu–xBi and Sn–([Formula: see text])Ag–0.5Cu[Formula: see text]([Formula: see text]) In systems, low Ag content quaternary Pb-free solder alloys, were produced by adding 0.5%, 1% and 2% Bi and In separately to the near-eutectic Sn-3[Formula: see text]wt.%Ag–0.5[Formula: see text]wt.%Cu (SAC305) alloy. The wetting angles of new alloys, Sn[Formula: see text]2.5[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]0.5[Formula: see text]wt.%Bi (SAC-0.5Bi), Sn[Formula: see text]2[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]1[Formula: see text]wt.%Bi(SAC-1Bi), Sn[Formula: see text]1[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]2[Formula: see text]wt.%Bi(SAC-2Bi), Sn[Formula: see text]2.5[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]0.5[Formula: see text]wt.%In (SAC-0.5In), Sn[Formula: see text]2[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]1[Formula: see text]wt.%In (SAC-1In) and Sn[Formula: see text]1[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt%.Cu[Formula: see text]2[Formula: see text]wt.%In (SAC-2In) were measured by sessile drop method. Experimental results showed that additions of Bi and In separately to SAC305 resulted in a continuous decrease in the [Formula: see text] up to 1[Formula: see text]wt.% above which the [Formula: see text] value was increased and it is appeared that a correlation among the [Formula: see text], alloys compositions and the test temperatures exists which recommended an empirical model to estimate the [Formula: see text] at a given Bi and In content and temperature for a given alloy systems. The numerical model estimates the [Formula: see text] understandably well with the present work.

中文翻译:

Cu衬底上Sn-(3-x)Ag-0.5Cu-x(Bi,In)四元无铅焊料合金体系润湿角的数值计算

本文旨在研究Sn-Ag-Cu、Sn-([公式:见文])Ag-0.5Cu-([公式:见文])Bi的润湿角([公式:见文])和Sn-([公式:见正文])Ag-0.5Cu-([公式:见正文])In ([公式:见正文], 1 和 2 in wt.%) 各种温度下的无铅焊料合金系统 ( 250、280 和 310C) 在 Ar 气氛中的 Cu 衬底上。新的 Sn-([公式:见正文])Ag-0.5Cu-xBi 和 Sn-([公式:见正文])Ag-0.5Cu[公式:见正文]([公式:见正文]) 在系统中,低银含量四元无铅焊料合金,分别在近共晶 Sn-3 中添加 0.5%、1% 和 2% Bi 和 In [公式:见正文]wt.%Ag–0.5[公式:见text]wt.%Cu (SAC305) 合金。新合金的润湿角,Sn[公式:见文]2.5[公式:见文]wt.%Ag[公式:见文]0.5[公式:见文]wt.%Cu[公式:见文]0.5[公式:见正文]wt.%Bi (SAC-0.5Bi)、Sn[公式:见正文]2[公式:见正文]wt.%Ag[公式:见正文]0.5[公式:见正文]wt.% Cu[分子式:见文字]1[分子式:见文字]wt.%Bi(SAC-1Bi)、Sn[分子式:见文字]1[分子式:见文字]wt.%Ag[分子式:见文字]0.5[公式:见文]wt.%Cu[公式:见文]2[公式:见文]wt. %Bi(SAC-2Bi), Sn[分子式:见文字]2.5[分子式:见文字]wt.%Ag[分子式:见文字]0.5[分子式:见文字]wt.%Cu[分子式:见文字]0.5 [公式:见文]wt.%In (SAC-0.5In), Sn[公式:见文]2[公式:见文]wt.%Ag[公式:见文]0.5[公式:见文]wt. %Cu[分子式:见文字]1[分子式:见文字]wt.%In (SAC-1In)和Sn[分子式:见文字]1[分子式:见文字]wt.%Ag[分子式:见文字]0.5 [分子式:见正文]wt%.Cu[分子式:见正文]2[分子式:见正文]wt.%In(SAC-2In)采用悬滴法测定。实验结果表明,在 SAC305 中分别添加 Bi 和 In 导致 [公式:见文本] 持续下降 1[公式:见文本] wt.%,高于此 [公式:见文本] 值增加,并且[公式:见正文]之间似乎存在相关性,合金成分和测试温度的存在推荐了一个经验模型来估计给定合金系统在给定 Bi 和 In 含量和温度下的 [公式:见文本]。数值模型在目前的工作中可以很好地估计 [公式:见正文]。
更新日期:2020-06-12
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