Diamond etching of [Formula: see text] orientation is processed in chemical vapor deposition (CVD) chamber using H2 as reactive gas. Etching process happens on diamond substrates using a variety of etch mask materials including copper and nickel. Scanning electron microscope (SEM) and atomic force microscope (AFM) show different kinds of diamond etching pattern of two mask materials. It is observed that the etching pit of copper is tetrahedron, while the etching pit of nickel is step structure. This indicates diverse etching mechanism of diamond etched by different metal. Observing the surface etching topography of diamond and analyzing the etching mechanism of different metal can help study the growth of diamond by CVD and controllable etching of diamond.

中文翻译：

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Ni和Cu包覆金刚石<100>取向刻蚀图案的研究

[公式：见正文] 取向的金刚石蚀刻在化学气相沉积 (CVD) 室中使用 H 进行处理2作为反应气体。使用各种蚀刻掩模材料（包括铜和镍）在金刚石基板上进行蚀刻工艺。扫描电子显微镜 (SEM) 和原子力显微镜 (AFM) 显示了两种掩模材料的不同种类的金刚石蚀刻图案。观察到铜的蚀坑为四面体，而镍的蚀坑为阶梯结构。这表明了不同金属蚀刻金刚石的不同蚀刻机制。观察金刚石的表面刻蚀形貌，分析不同金属的刻蚀机理，有助于研究金刚石的CVD生长和金刚石的可控刻蚀。