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A comparative study of the influence of the deposition technique (electrodeposition versus sputtering) on the properties of nanostructured Fe70Pd30 films
Science and Technology of Advanced Materials ( IF 7.4 ) Pub Date : 2020-01-31 , DOI: 10.1080/14686996.2020.1780097
Matteo Cialone 1, 2 , Monica Fernandez-Barcia 3 , Federica Celegato 2 , Marco Coisson 2 , Gabriele Barrera 2 , Margitta Uhlemann 3 , Annett Gebert 3 , Jordi Sort 4, 5 , Eva Pellicer 4 , Paola Rizzi 1 , Paola Tiberto 2
Affiliation  

ABSTRACT Sputtering and electrodeposition are among the most widespread techniques for metallic thin film deposition. Since these techniques operate under different principles, the resulting films typically show different microstructures even when the chemical composition is kept fixed. In this work, films of Fe70Pd30 were produced in a thickness range between 30 and 600 nm, using both electrodeposition and sputtering. The electrodeposited films were deposited under potentiostatic regime from an ammonia sulfosalicylic acid-based aqueous solution. Meanwhile, the sputtered films were deposited from a composite target in radio frequency regime. Both approaches were proven to yield high quality and homogenous films. However, their crystallographic structure was different. Although all films were polycrystalline and Fe and Pd formed a solid solution with a body-centered cubic structure, a palladium hydride phase was additionally detected in the electrodeposited films. The occurrence of this phase induced internal stress in the films, thereby influencing their magnetic properties. In particular, the thickest electrodeposited Fe70Pd30 films showed out-of-plane magnetic anisotropy, whereas the magnetization easy axis lied in the film plane for all the sputtered films. The domain pattern of the electrodeposited films was investigated by magnetic force microscopy. Finally, nanoindentation studies highlighted the high quality of both the sputtered and electrodeposited films, the former exhibiting higher reduced Young’s modulus and Berkovich hardness values.

中文翻译:

沉积技术(电沉积与溅射)对纳米结构 Fe70Pd30 薄膜性能影响的比较研究

摘要 溅射和电沉积是金属薄膜沉积最广泛的技术之一。由于这些技术在不同的原理下运作,因此即使化学成分保持固定,所得薄膜通常也会显示不同的微观结构。在这项工作中,Fe70Pd30 薄膜的厚度范围在 30 到 600 nm 之间,使用电沉积和溅射。电沉积膜在恒电位方案下从氨磺基水杨酸基水溶液沉积。同时,溅射薄膜是在射频范围内从复合靶上沉积的。两种方法都被证明可以产生高质量和均匀的薄膜。然而,它们的晶体结构不同。尽管所有薄膜都是多晶的,并且 Fe 和 Pd 形成了具有体心立方结构的固溶体,但在电沉积薄膜中还检测到了氢化钯相。该相的出现会在薄膜中引起内应力,从而影响其磁性能。特别是,最厚的电沉积 Fe70Pd30 薄膜显示出面外磁各向异性,而所有溅射薄膜的易磁化轴位于薄膜平面内。通过磁力显微镜研究电沉积膜的畴图案。最后,纳米压痕研究强调了溅射和电沉积薄膜的高质量,前者表现出更高的杨氏模量和伯科维奇硬度值。在电沉积薄膜中还检测到氢化钯相。该相的出现会在薄膜中引起内应力,从而影响其磁性能。特别是,最厚的电沉积 Fe70Pd30 薄膜显示出面外磁各向异性,而所有溅射薄膜的易磁化轴位于薄膜平面内。通过磁力显微镜研究电沉积膜的畴图案。最后,纳米压痕研究强调了溅射和电沉积薄膜的高质量,前者表现出更高的杨氏模量和伯科维奇硬度值。在电沉积薄膜中还检测到氢化钯相。该相的出现会在薄膜中引起内应力,从而影响其磁性能。特别是,最厚的电沉积 Fe70Pd30 薄膜显示出面外磁各向异性,而所有溅射薄膜的易磁化轴位于薄膜平面内。通过磁力显微镜研究电沉积膜的畴图案。最后,纳米压痕研究强调了溅射和电沉积薄膜的高质量,前者表现出更高的杨氏模量和伯科维奇硬度值。最厚的电沉积 Fe70Pd30 薄膜显示出面外磁各向异性,而所有溅射薄膜的易磁化轴位于薄膜平面内。通过磁力显微镜研究电沉积膜的畴图案。最后,纳米压痕研究强调了溅射和电沉积薄膜的高质量,前者表现出更高的杨氏模量和伯科维奇硬度值。最厚的电沉积 Fe70Pd30 薄膜显示出面外磁各向异性,而所有溅射薄膜的易磁化轴位于薄膜平面内。通过磁力显微镜研究电沉积膜的畴图案。最后,纳米压痕研究强调了溅射和电沉积薄膜的高质量,前者表现出更高的杨氏模量和伯科维奇硬度值。
更新日期:2020-01-31
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