Abstract

In this work, we developed the electromagnetic shielding effective (EMI SE) polyester woven fabrics by simple electroless plating with copper. Subsequently, it was coated with various precursors to investigate their influence on the EMI SE values. In addition, we studied the effect of copper sulfate concentration and the number of dips required to improve the EMI SE values. The results of the experiment confirm that the Cu particle deposition on the fabric has a strong influence on the EMI SE values. EMI shielding is directly proportional to the concentration of copper particles as well as the sol-gel coating process. However, the EMI SE value of sol-gel coated Cu-plated fabric depends on the type of precursor. Among the precursors, Triethoxyphenylsilane provides two times higher EMI SE values than the Cu-plated fabrics which is a novel effect. The morphology of deposited copper particles was studied by employing SEM analysis in order to find the durability of copper particles on the polyester fabric surface. It was observed that the copper particles that are coated on the fabric pores have no significant decrease in air permeability due to partial coverage.

摘要

在这项工作中，我们通过简单的化学镀铜工艺开发了电磁屏蔽有效（EMI SE）聚酯机织织物。随后，将其涂上各种前驱物以研究其对EMI SE值的影响。此外，我们研究了硫酸铜浓度的影响以及改善EMI SE值所需的骤降次数。实验结果证实，铜颗粒在织物上的沉积对EMI SE值有很大的影响。EMI屏蔽与铜颗粒的浓度以及溶胶-凝胶涂覆工艺成正比。但是，溶胶-凝胶涂覆的铜镀层织物的EMI SE值取决于前驱体的类型。在前体中，三乙氧基苯基硅烷的EMI SE值是镀铜织物的两倍，这是一种新颖的效果。通过使用SEM分析研究沉积的铜颗粒的形态，以发现铜颗粒在聚酯织物表面上的耐久性。观察到，由于部分覆盖，涂覆在织物孔上的铜颗粒的透气性没有显着降低。