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Effects of Annealing on the Behavior of Sn in GeSn Alloy and GeSn-Based Photodetectors
IEEE Transactions on Electron Devices ( IF 2.9 ) Pub Date : 2020-08-01 , DOI: 10.1109/ted.2020.3004123
Liming Wang , Yichi Zhang , Yifei Wu , Tao Liu , Yuanhao Miao , Lingyao Meng , Zuimin Jiang , Huiyong Hu

Ge $_{{1}-{x}}$ Snx alloy films with Sn contents of 3% and 10% were grown on Si wafers by low-temperature nonequilibrium molecular beam epitaxy. The thermostabilities of the GeSn films and photodetectors containing them were studied. No Sn segregation was observed in Ge0.97Sn0.03 films annealed below 750 °C. Conversely, Sn segregation occurred and Sn nanoparticles formed within the Ge0.90Sn0.10 films annealed above 400 °C. Upon increasing the annealing temperature to 750 °C, Sn particles were thermally driven and segregated on the surface of both Ge0.97Sn0.03 and Ge0.90Sn0.10 films. Photodetectors were fabricated based on the as-grown and annealed Ge0.90Sn0.10 films. Because of the decreased defect content of the Ge0.90Sn0.10 film after annealing, the dark current of the GeSn photodetectors decreased obviously and the responsivity of the devices increased. These results are fundamentally important for the applications of high-performance photodetectors and lasers based on GeSn alloys.

中文翻译:

退火对 GeSn 合金和 GeSn 基光电探测器中 Sn 行为的影响

$_{{1}-{x}}$ X通过低温非平衡分子束外延在Si晶片上生长Sn含量为3%和10%的合金薄膜。研究了 GeSn 薄膜和包含它们的光电探测器的热稳定性。在低于 750 °C 退火的Ge 0.97 Sn 0.03薄膜中没有观察到 Sn 偏析。相反,在 400 °C 以上退火的 Ge 0.90 Sn 0.10薄膜中会发生 Sn 偏析并形成 Sn 纳米颗粒。在将退火温度提高到 750 °C 后,Sn 颗粒被热驱动并在 Ge 0.97 Sn 0.03和 Ge 0.90 Sn 0.10薄膜的表面分离。基于生长和退火的 Ge 制造光电探测器0.90 Sn 0.10薄膜。由于退火后Ge 0.90 Sn 0.10薄膜的缺陷含量降低,GeSn光电探测器的暗电流明显降低,器件的响应度增加。这些结果对于基于 GeSn 合金的高性能光电探测器和激光器的应用至关重要。
更新日期:2020-08-01
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