Recent advances in CMOS imaging sensor technology have led to designs able to withstand much higher radiation levels, up to those required at hadron colliders for all but the innermost layers. Also, with stitching, wafer scale devices have been fabricated on the same process as used for the prototypes described in this submission, for applications such as, for example, direct electron detection in transmission electron microscopy. A small sensor prototype has been designed and fabricated in the TowerJazz 180 nm CMOS imaging process. The prototype has a pixel matrix of 64x64 pixels with a pitch of 55 x $55\mathrm{\mu }\mathrm{m}$ and reads out using fast logic at 40 MHz. Each pixel contains four collection electrodes, trimming logic, pre-amplifier, shaper and discriminator with digital output. It can be reconfigured to function as either a binary short strip sensor, for particle tracking including as a pre-shower, or as a pad sensor, counting the number of pixels above threshold for digital calorimetry. As well as providing a seamless transition from outer tracking to EM calorimetry, for optimal use of particle flow algorithms, digital calorimetry also can give excellent energy resolution. This concept is proposed as a possible option for future digital calorimeters able to read-out at LHC collision rates with good radiation hardness and realisable in low cost commercial technologies for equipping large areas. Results on physics performance simulation in a FCC-hh context and the characterisation of the prototype sensor are presented. The summing logic is demonstrated and the analogue pixel performance is validated by illuminating a test pixel within the matrix with a laser of wavelength of 1064 nm. The absolute laser intensity is calibrated such that the injected charge is similar to that expected for a minimum ionising particle. The measured pre-amplifier and shaper signals are compared to Cadence simulations. Laser illuminations in the digital pixel area and the response measured using a threshold scan confirm successful digital functionality in strip and pad operation modes.

CMOS成像传感器技术的最新进展已导致设计能够承受更高的辐射水平，达到强子对撞机对除最内层以外所有层的要求。而且，通过缝合，已经用与本申请中描述的原型相同的工艺制造了晶片级器件，用于诸如透射电子显微镜中的直接电子检测之类的应用。在TowerJazz 180 nm CMOS成像过程中设计并制造了一个小型传感器原型。该原型的像素矩阵为64x64像素，间距为55 x$55\mathrm{\mu }\mathrm{米}$并使用40 MHz的快速逻辑读出。每个像素包含四个采集电极，微调逻辑，前置放大器，整形器和带数字输出的鉴别器。可以将其重新配置为用作二进制短条形传感器，以进行粒子跟踪（包括作为预喷头），或用作垫块传感器，以计数高于数字量热法阈值的像素数。除了提供从外部跟踪到EM量热的无缝过渡之外，为了优化使用粒子流算法，数字量热还可以提供出色的能量分辨率。对于未来的数字量热仪，该概念被提出为可能的选择，该数字量热仪能够以LHC碰撞速率读出具有良好的辐射硬度，并且可以在装备大型区域的低成本商业技术中实现。提出了在FCC-hh环境下进行物理性能仿真的结果以及原型传感器的特性。演示了求和逻辑，并通过用1064 nm波长的激光照射矩阵内的测试像素来验证模拟像素的性能。校准绝对激光强度，以使注入的电荷与最小电离粒子的预期电荷相似。将测得的前置放大器和整形器信号与Cadence仿真进行比较。数字像素区域中的激光照射和使用阈值扫描测量的响应，确认了剥离和焊盘操作模式下成功的数字功能。演示了求和逻辑，并通过用1064 nm波长的激光照射矩阵内的测试像素来验证模拟像素的性能。校准绝对激光强度，以使注入的电荷与最小电离粒子的预期电荷相似。将测得的前置放大器和整形器信号与Cadence仿真进行比较。数字像素区域中的激光照射和使用阈值扫描测量的响应，确认了剥离和焊盘操作模式下成功的数字功能。演示了求和逻辑，并通过用1064 nm波长的激光照射矩阵内的测试像素来验证模拟像素的性能。校准绝对激光强度，以使注入的电荷与最小电离粒子的预期电荷相似。将测得的前置放大器和整形器信号与Cadence仿真进行比较。数字像素区域中的激光照射和使用阈值扫描测量的响应，确认了剥离和焊盘操作模式下成功的数字功能。