Abstract Moisture induced failure is one of the major reliability concerns in electronic packaging. This research provides a comprehensive solution for modeling the moisture induced delamination in electronic packaging during solder reflow. Existing finite element approaches of studying the moisture and vapor pressure induced package delamination issue were discussed, reviewed, summarized and integrated into a systematic approach. This study covered multiple related topics, including diffusion modeling techniques under dynamic thermal loading conditions, fracture mechanics modeling methods for bi-material cracks, and methodologies of applying integrated hygro-thermal-vapor loading conditions. A novel analogy was proposed for applying the combined hygro-thermal-vapor loading in modeling the moisture induced package delamination, which could reduce the users' effort in dealing with the multiple-loading boundary conditions in the fracture mechanics finite element simulation. In the end, the comprehensive finite element approach introduced in this study was implemented to model the moisture induced delamination in a stacked die package during solder reflow.

中文翻译：

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用于模拟回流焊期间电子封装中水分引起的分层的综合解决方案

摘要 湿气引起的失效是电子封装中主要的可靠性问题之一。这项研究为模拟回流焊期间电子封装中的水分引起的分层提供了全面的解决方案。讨论、回顾、总结了现有的研究水分和蒸汽压力引起的包装分层问题的有限元方法，并将其整合到系统方法中。该研究涵盖了多个相关主题，包括动态热载荷条件下的扩散建模技术、双材料裂纹的断裂力学建模方法以及应用综合湿热蒸汽加载条件的方法。提出了一种新的类比，用于在模拟湿气引起的包装分层时应用组合的湿热蒸汽负载，这可以减少用户在断裂力学有限元模拟中处理多载荷边界条件的工作量。最后，本研究中引入的综合有限元方法用于模拟回流焊期间堆叠芯片封装中的湿气引起的分层。