Multichip modules (MCM) is the standard solution for high power density in high current applications, which contains a multiple parallel-connected semiconductor devices inside the same package. Due to the limited space and parametric variations, it is not realistic to achieve homogeneous temperature among the devices. This temperature mismatch provokes different thermal stress, thereby reducing the lifetime of the hotter ones. As a solution, this work investigate the pulse-shadowing strategy, applied for the thermal balancing in MCM. Based on junction temperature sensing through a single collector-emitter voltage sensing circuit, the hotter devices are shadowed during specific periods. To validate the temperature distribution among the dies, a finite elements model of a 24-dies MCM is developed and a setup with a 3-chips MCM is constructed. In addition, a case study is carried out to evaluate the impact of the thermal balancing on the reliability and efficiency of MCMs.

中文翻译：

---

多芯片模块中基于脉冲阴影的热平衡

多芯片模块 (MCM) 是高电流应用中高功率密度的标准解决方案，它在同一封装内包含多个并联的半导体器件。由于有限的空间和参数变化，在设备之间实现均匀的温度是不现实的。这种温度不匹配会引起不同的热应力，从而缩短较热的寿命。作为解决方案，这项工作研究了应用于 MCM 热平衡的脉冲阴影策略。基于通过单个集电极-发射极电压感测电路进行的结温感测，较热的器件在特定时间段被遮蔽。为了验证芯片之间的温度分布，开发了 24 芯片 MCM 的有限元模型，并构建了具有 3 芯片 MCM 的设置。