In reactive ion etching process, generation of particles and deterioration in process reproducibility due to high aspect ratio processing have become problems. In this study, YF 3 coating was investigated using collision assisted sintering process (CASP) technique to reduce particles and improve process reproducibility. It was clarified that the CASP had possibility of a high-density coating with fewer cracks and voids than atmospheric plasma spraying (APS) coating. The amount of etching and surface roughness reduced to 92% and 31%, respectively, as compared to APS coating. The surface polishing for the APS-YF 3 coating also reduced the amount of etching by 4%, and the CASP-YF 3 /APS-Y 2 O 3 structural coating reduces desorption rate of particles by 25%. These results suggested that the possibility of suppressing particle generation and improving process reproducibility due to a high-density coating.

中文翻译：

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反应离子刻蚀中碰撞辅助烧结工艺改善YF 3涂层的工艺可重复性和减少颗粒

在反应性离子蚀刻工艺中，由于高纵横比加工而导致的颗粒的产生和工艺再现性的降低已成为问题。在这项研究中，使用碰撞辅助烧结工艺（CASP）技术对YF 3涂层进行了研究，以减少颗粒并提高工艺可重复性。可以肯定的是，与大气等离子喷涂（APS）涂层相比，CASP有可能形成高密度涂层，且裂纹和空隙更少。与APS涂层相比，蚀刻量和表面粗糙度分别降低到92％和31％。APS-YF 3涂层的表面抛光也将蚀刻量减少了4％，而CASP-YF 3 / APS-Y 2 O 3结构涂层将颗粒的解吸率降低了25％。