This paper aims to develop thermal analysis method of thermal joints characterization. The impact on convection on thermal resistance analysis with use thermography for silver-based thermal joints were investigated for non-metallized and metalized semiconductor surfaces. Heat transfer efficiency depends on thermal conductivity; radiation was used to perform thermographic analysis; the convection is energy loss, so its removing might improve measurements accuracy.,Investigation of thermal joints analysis method was focused on determination of convection impact on thermal resistance thermographic analysis method. Measuring samples placed in vacuum chamber with lowered pressure requires transparent window for infrared radiation that is used for thermographic analysis. Impact of infrared window and convection on temperature measurements and thermal resistance were referred.,The results showed that the silicon window allowed to perform thermal analysis through, and the convection was heat transfer mode which create 15% energy loss.,It is possible to measure thermal resistance for silver-based thermal joints with convection eliminated to improve measurements accuracy.

中文翻译：

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对流对银基热接头热成像分析的影响

本文旨在开发热接头表征的热分析方法。针对非金属化和金属化半导体表面，研究了使用热成像对银基热接头的热阻分析对流的影响。传热效率取决于热导率；辐射用于进行热成像分析；对流是能量损失,去除对流可能会提高测量精度。,热接头分析方法的研究重点是确定对流对热阻热像分析方法的影响。测量放置在减压真空室中的样品需要用于热成像分析的红外辐射透明窗口。