The paper aims to present an investigation on heat transfer in a vapour phase soldering (VPS) oven, focusing on the differences of horizontally and vertically aligned Printed Circuit Board (PCB) surfaces. The investigation can help develop a better understanding of the process and provide information for future modelling of the process.,For the investigations, flame retardant grade 4 (FR4) PCB plates and sealed plate–based boxes were immersed into saturated vapour of an experimental oven. The temperature and resulting heat transfer coefficients were analysed according to the sample boxes and the surface orientations. In addition, the boxes’ vapour consumption was investigated with pressure measurements.,The horizontal top- and bottom-side heating shows very similar results. In addition, the sides of a box were heated in a manner similar to the top and the bottom sides, but there was a slight increase in the heat transfer coefficient because of the vertical wall alignment. The pressure measurements reveal the dynamic changes in vapour after immersion of the boxes.,The findings may help to show differences on different surface orientations, pointing to more precise, explicit and multiphysics simulation results.,The experiments present an aspect of heat transfer coefficient differences in VPS ovens, also highlighting the effect of initial pressure drop inside the workspace of an oven.

中文翻译：

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在对齐的基于 PCB 的表面上进行气相焊接时冷凝的传热方面

本文旨在对气相焊接 (VPS) 烤箱中的热传递进行研究，重点关注水平和垂直对齐的印刷电路板 (PCB) 表面的差异。该调查有助于更好地了解该过程并为未来的过程建模提供信息。在调查中，将阻燃等级 4 (FR4) PCB 板和基于密封板的盒子浸入实验烤箱的饱和蒸汽中. 根据样品盒和表面取向分析温度和由此产生的传热系数。此外，通过压力测量研究了盒子的蒸汽消耗。水平顶部和底部加热显示了非常相似的结果。此外，盒子的侧面以类似于顶部和底部的方式加热，但由于垂直壁对齐，传热系数略有增加。压力测量揭示了盒子浸入后蒸汽的动态变化。,这些发现可能有助于显示不同表面方向的差异，指出更精确、明确和多物理场的模拟结果。,实验展示了传热系数差异的一个方面在 VPS 烤箱中，还突出了烤箱工作区内初始压降的影响。