Purpose

This study aims to investigate simultaneous power and thermal loading.

Design/methodology/approach

Finite element method simulations coupled with experiments.

Findings

The effects of power cycling have been determined.

Originality/value

This paper aims to testify the combined effects of thermal and power cycling loads on the reliability of solder ball joints with barrel- and hourglass-type geometries in an electronic system. The finite element simulation outcomes showed that the maximum strain energy was accumulated at the edges of barrel-type solder, whereas the hourglass-type was vulnerable at the necking side. It was also found that the hourglass-type solder showed a reliable behavior when the sole thermal cycling was exerted to the electronic system, whereas the barrel-type solder was a better choice under simultaneous application of thermal and power loadings. The experimental results also confirmed the finite element simulation and indicated that the solder joint reliability strongly depends on the geometry of interconnection in different operating conditions. An extensive discussion was presented to shed light on the paramount importance of combined thermal/power cycling on the reliability of solder joints.

中文翻译：

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热循环和功率循环联合应用下球栅阵列接头的可靠性评估：焊料几何效应

目的

这项研究旨在调查同时的功率和热负荷。

设计/方法/方法

有限元方法模拟与实验相结合。

发现

功率循环的影响已经确定。

创意/价值

本文旨在验证热循环和功率循环负荷对电子系统中具有桶形和沙漏形几何形状的焊球接头可靠性的综合影响。有限元模拟结果表明，最大应变能累积在桶形焊料的边缘，而沙漏型则在颈缩侧易受腐蚀。还发现，当将唯一的热循环应用于电子系统时，沙漏型焊料表现出可靠的性能，而在同时施加热和功率负载的情况下，桶型焊料是更好的选择。实验结果还证实了有限元模拟，并表明焊点可靠性在很大程度上取决于不同工作条件下互连的几何形状。