Purpose

The purpose of this paper is to investigate the effect of carbon nanotube (CNT) addition on microstructure, interfacial intermetallic compound (IMC) layer and micromechanical properties of Sn-3.0Ag-0.5Cu (SAC305)/CNT/Cu solder joint under blast wave condition. This work is an extension from the previous study of microstructural evolution and hardness properties of Sn-Ag-Cu (SAC) solder under blast wave condition.

Design/methodology/approach

SAC/CNT solder pastes were manufactured by mixing of SAC solder powder, fluxes and CNT with 0.02 and 0.04 by weight percentage (Wt.%) separately. This solder paste then printed on the printed circuit board (PCB) with the copper surface finish. Printed samples underwent reflow soldering to form the solder joint. Soldered samples then exposed to the open field air blast test with different weight charges of explosives. Microstructure, interfacial IMC layer and micromechanical behavior of SAC/CNT solder joints after blast test were observed and analyzed via optical microscope, field emission scanning microscope and nanoindentation.

Findings

Exposure to the blast wave induced the microstructure instability of SAC305/Cu and SAC/CNT/Cu solder joint. Interfacial IMC layer thickness and hardness properties increases with increase in explosive weight. The existence of CNT in the SAC305 solder system is increasing the resistance of solder joint to the blast wave.

Originality/value

Response of micromechanical properties of SAC305/CNT/Cu solder joint has been identified and provided a fundamental understanding of reliability solder joint, especially in extreme conditions such as for military applications.

中文翻译：

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爆炸条件下SAC305 / CNT / CU焊点的组织演变和微机械性能

目的

本文的目的是研究碳纳米管（CNT）的添加对爆炸波作用下Sn-3.0Ag-0.5Cu（SAC305）/ CNT / Cu焊点的微观结构，界面金属间化合物（IMC）层和微机械性能的影响。健康）状况。这项工作是对先前在爆炸波条件下Sn-Ag-Cu（SAC）焊料的显微组织演变和硬度特性的研究的扩展。

设计/方法/方法

SAC / CNT焊膏是通过分别将SAC焊粉，助焊剂和CNT与0.02和0.04重量百分比（重量％）混合而制成的。然后，将该焊膏以铜表面涂层印刷在印刷电路板（PCB）上。印刷样品经过回流焊接形成焊点。然后，将焊接后的样品暴露在露天场所的爆炸试验中，并使用不同重量的炸药。通过光学显微镜，场发射扫描显微镜和纳米压痕对喷砂试验后的SAC / CNT焊点的微观结构，界面IMC层和微力学行为进行了观察和分析。

发现

暴露在爆炸波中会引起SAC305 / Cu和SAC / CNT / Cu焊点的组织不稳定性。界面IMC层厚度和硬度特性随炸药重量的增加而增加。SAC305焊料系统中CNT的存在增加了焊点对冲击波的抵抗力。

创意/价值

已经确定了SAC305 / CNT / Cu焊点的微机械性能响应，并为可靠性焊点提供了基本的了解，尤其是在极端条件下，例如军事应用。