This paper aims to investigate the fatigue life performance of SAC305 ball grid array solders under combined temperature and harmonic vibration loading conditions.,Fatigue tests were performed using a sine dwell with resonance tracking vibration and temperature loading experiment. Finite element stress analysis was also performed to help in understanding the observed failure trends.,Fatigue test results showed that the lead-free solders tend to fail quickly in higher temperatures and higher vibration loading test conditions. The failure analysis results revealed that in low temperatures, the solder cracks are initiated and propagated at the package side. However, in high temperatures, the cracks are observed at the board side of the interconnect. In all conditions, the cracks are propagated throughout the intermetallic compound layer.,In the published literature, there is a lack of data in the area of fatigue assessment of lead-free solders under combined temperature and vibration loadings. This paper provides useful insights into combined thermal/vibration fatigue, i.e. reliability behavior of lead-free solder joint types.

中文翻译：

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SAC305 焊料在温度和谐波振动载荷下的实验和数值疲劳寿命评估

本文旨在研究SAC305球栅阵列焊料在组合温度和谐波振动加载条件下的疲劳寿命性能。疲劳测试采用正弦驻留和共振跟踪振动和温度加载实验进行。还进行了有限元应力分析，以帮助了解观察到的失效趋势。疲劳试验结果表明，无铅焊料在较高温度和较高振动载荷试验条件下往往会迅速失效。失效分析结果表明，在低温下，焊料裂纹在封装侧开始并传播。然而，在高温下，在互连的板侧观察到裂纹。在所有条件下，裂纹都会在整个金属间化合物层中传播。在已发表的文献中，在组合温度和振动载荷下无铅焊料的疲劳评估领域缺乏数据。本文提供了对组合热/振动疲劳的有用见解，即无铅焊点类型的可靠性行为。