This paper aims to present an efficient method to improve quality factor of printed fractal inductors based on electromagnetic band-gap (EBG) surface.,Hilbert fractal inductor is designed and simulated using high-frequency structural simulator. To improve the quality factor, an EBG surface underneath the inductor is incorporated without any degradation in inductance value.,The proposed inductor and Q factor are measured based on well-known three-dimensional simulator, and the results are compared experimentally.,The proposed method was able to significantly decrease the noise with increase in the speed of radio frequency and sensor-integrated circuit design.,Fractal inductor is designed and simulated with and without EBG surfaces. The measurement of printed circuit board prototypes demonstrates that the inclusion of split-ring array as EBG surface increases the quality factor by 90 per cent over standard fractal inductor of the same dimensions with a small degradation in inductance value and is capable of operating up to 2.4 GHz frequency range.

中文翻译：

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具有互补裂环阵列的高品质因数分形电感器

本文旨在提出一种基于电磁带隙(EBG)表面提高印刷分形电感器品质因数的有效方法。,利用高频结构模拟器设计并仿真了希尔伯特分形电感器。为了提高品质因数，在电感器下方加入了 EBG 表面，而不会降低电感值。,基于众所周知的 3D 模拟器测量了所提出的电感器和 Q 因数，并通过实验对结果进行了比较。,所提出的方法能够随着射频和传感器集成电路设计速度的增加而显着降低噪声。设计和模拟分形电感器有和没有 EBG 表面。