Purpose

This study aims to present an optical alignment and compensation control of die bonder for chips containing through-silicon vias and develop three-dimensional integrated circuit stacked packaging for compact size and multifunction.

Design/methodology/approach

The machine vision, optical alignment method and sub-pixel technology in dynamic imaging condition are used. Through a comparison of reference image, the chip alignment calibration can improve machine accuracy and stability.

Findings

According to the experimental data and preliminary results of the analysis, accuracy can be achieved within the desired range, and the accuracy is much better than traditional die bonder equipment. The results help further research in die bonder for chips containing through-silicon vias.

Originality/value

In subsequent testing of the chip, the machine can simultaneously test multiple chips to save test time and increase productivity.

中文翻译：

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包含硅通孔的芯片的芯片键合机的光学对准和补偿控制

目的

这项研究的目的是为包含硅通孔的芯片提供芯片键合机的光学对准和补偿控制，并开发出尺寸紧凑，功能多样的三维集成电路堆叠封装。

设计/方法/方法

在动态成像条件下使用了机器视觉，光学对准方法和亚像素技术。通过比较参考图像，芯片对准校准可以提高机器精度和稳定性。

发现

根据实验数据和分析的初步结果，可以在期望的范围内达到精度，并且精度要比传统的芯片键合设备好得多。该结果有助于进一步研究包含硅通孔的芯片的芯片键合机。

创意/价值

在后续的芯片测试中，机器可以同时测试多个芯片，以节省测试时间并提高生产率。