Abstract Aluminum and Nickel elements simultaneously deposited on the surface of copper by pack cementation was investigated. SEM examinations reveal that the coating consists of three layers. The outermost layer (adhesion layer) consists of Al2O3, Cu9Al4 and AlNi3 intermetallic compounds and Ni-based solid solution. The intermediate layer (diffusion layer) is composed of the Cu9Al4, AlNi, AlNi3 intermetallic compounds and Cu-based solid solution. The micrographs of diffusion layer show that it can be divided into striped and blocky areas. The innermost layer (solid solution layer) is Cu-based solid solution. Possible mechanism of Al and Ni co-penetration on Cu was also deduced. The hardness of coating is greatly higher (7 times in adhesion layer and 5 times in diffusion layer) than that of copper. The thermal conductivity of coating was 132.534–142.527 W m−1 K−1 in the temperature range of 300 °C–500 °C.

中文翻译：

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通过填充渗碳在铜上同时沉积 Al-Ni 的显微组织形成和表面强化

摘要 研究了铝和镍元素通过填充渗碳同时沉积在铜表面。SEM 检查表明涂层由三层组成。最外层（粘附层）由Al2O3、Cu9Al4和AlNi3金属间化合物和Ni基固溶体组成。中间层（扩散层）由Cu9Al4、AlNi、AlNi3金属间化合物和Cu基固溶体组成。扩散层显微照片显示可分为条纹和块状区域。最内层（固溶体层）为Cu系固溶体。还推导出了Al和Ni在Cu上共渗透的可能机制。镀层的硬度大大高于铜（粘附层的7倍，扩散层的5倍）。涂层的导热系数为132。