The machining characteristics of glass substrates containing chemical components were investigated for the purpose of femtosecond laser helical drilling. A femtosecond laser of wavelength 1552 nm and pulse duration 800 fs was adopted in the laser machining system. The substrates investigated were aluminosilicate, soda-lime, and borosilicate glass. The chemical components contained in each glass substrate were quantitatively analyzed by laser ablation-induced chemical plasma mass spectrometry. The characteristics of the drilling conditions for each glass substrate were affected by its chemical components. As the wt% of Al₂O₃ and MgO components in the glass substrates increased, the ablation threshold energy of each substrate decreased, resulting in greater vertical speed of the laser head.

为了飞秒激光螺旋钻孔的目的，研究了包含化学成分的玻璃基板的加工特性。在激光加工系统中采用了波长为1552 nm，脉冲持续时间为800 fs的飞秒激光。研究的基材为硅铝酸盐，钠钙和硼硅酸盐玻璃。通过激光烧蚀诱导化学等离子体质谱法定量分析每个玻璃基板中包含的化学成分。每个玻璃基板的钻孔条件特征都受到其化学成分的影响。以Al ₂ O ₃的重量％计 并且玻璃基板中的MgO成分增加，每个基板的烧蚀阈值能量降低，从而导致激光头的垂直速度更高。