ABSTRACT In this paper, a combined processing method of mechanical alloying and infiltration was used to prepare the WCu-x wt-%SiC (x = 0.5, 1, 2, 3) composites. The microstructure, density, electrical conductivity and compressive behaviour of the composites were studied comparatively. First a decreasing and then an increasing particle growth trend was obtained, indicating that a small content of SiC below 1 wt-% was beneficial for particle refinement. Besides this, with the increase of the SiC content, both the density and electrical conductivity decreased gradually. Consistent with the particle–particle contiguity of the highest value of 0.404, the WCu-1 wt-%SiC composite showed the best compressive properties. Further electron backscattering diffraction results revealed that the ultrafine-grained SiC particles, which are distributed homogeneously in the composite with lower Schmid factor values would perturb the dislocation motion to make proliferation of more dislocations, exhibiting unordinary strain-hardening during deformation.

中文翻译：

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通过机械合金化和铜渗入预烧结骨架制备超细晶粒 W-Cu-SiC 复合材料

摘要 在本文中，采用机械合金化和渗透相结合的加工方法制备了 WCu-x wt-% SiC (x = 0.5, 1, 2, 3) 复合材料。对复合材料的微观结构、密度、电导率和压缩行为进行了比较研究。获得了先减少然后增加的颗粒生长趋势，表明低于 1 wt% 的少量 SiC 有利于颗粒细化。除此之外，随着SiC含量的增加，密度和电导率逐渐下降。与最高值 0.404 的颗粒-颗粒邻接一致，WCu-1 wt-% SiC 复合材料显示出最好的压缩性能。进一步的电子背散射衍射结果表明，超细晶粒 SiC 颗粒，