The light extraction structure (LES) on substrate for chip-on-board (COB) packaging light-emitting diodes is an effective means to address the intrinsic problem—the total internal reflection occurred within a COB packaging device. This work develops a new manufacturing method—micro-rolling forming to machine inverted pyramid LESs with high efficiency and low cost. In this method, a roller with closely arrayed micro pyramid teeth is designed and rolled on a copper substrate. A finite element model is established to analyze the forming process of the inverted pyramids and the forming process can be divided into four stages: elastic stage, yielding stage, hardening stage, full plastic deformation stage. The stress and strain mainly concentrate on the contact zone with the micro tooth abdomen. In this contact zone, the stress plateaus in the full plastic deformation stage are high and long, which drives the inverted pyramid formation. The side length of the inverted pyramid increases, while the cone angle decreases with the rolling depth increasing. Whereas the side length and cone angle vary slightly with the rolling speed increasing. The better rolling depth and speed for LES forming are 0.3–0.4 mm and 10–20 mm/s, respectively.

用于板载芯片（COB）封装发光二极管的基板上的光提取结构（LES）是解决固有问题（COB封装设备中发生的全内反射）的有效手段。这项工作开发了一种新的制造方法-微轧成形，以高效，低成本地加工倒金字塔金字塔LESs。在这种方法中，设计了具有紧密排列的微型金字塔齿的辊，并在铜基板上滚动。建立了一个有限元模型来分析倒金字塔的形成过程，该过程可以分为四个阶段：弹性阶段，屈服阶段，硬化阶段，全塑性变形阶段。应力和应变主要集中在与小牙齿腹部的接触区域。在这个接触区 整个塑性变形阶段的应力平台高而长，这驱动了倒金字塔的形成。倒金字塔的边长增加，而锥角随轧制深度的增加而减小。而边长和锥角随轧制速度的增加而略有变化。LES成形的更好的轧制深度和速度分别为0.3-0.4 mm和10-20 mm / s。