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Electrochemical corrosion behaviour of Sn–Sb solder alloys: the roles of alloy Sb content and type of intermetallic compound
Corrosion Engineering, Science and Technology ( IF 1.5 ) Pub Date : 2020-07-14 , DOI: 10.1080/1478422x.2020.1791446 Marcelino Dias 1 , Nathália C. Verissimo 1 , Natal N. Regone 2 , Emmanuelle S. Freitas 3 , Noé Cheung 1 , Amauri Garcia 1
Corrosion Engineering, Science and Technology ( IF 1.5 ) Pub Date : 2020-07-14 , DOI: 10.1080/1478422x.2020.1791446 Marcelino Dias 1 , Nathália C. Verissimo 1 , Natal N. Regone 2 , Emmanuelle S. Freitas 3 , Noé Cheung 1 , Amauri Garcia 1
Affiliation
Sn–Sb solder alloys (2; 5.5 and 10wt-% Sb) were directionally solidified with a view to permitting the effect of a wide range of solidification cooling rates to be related to the resulting microstr...
中文翻译：
Sn-Sb 焊料合金的电化学腐蚀行为：合金 Sb 含量和金属间化合物类型的作用
Sn-Sb 焊料合金 (2; 5.5 和 10wt-% Sb) 被定向凝固，目的是允许大范围的凝固冷却速率的影响与所得的微观结构有关。
更新日期：2020-07-14
中文翻译：
Sn-Sb 焊料合金的电化学腐蚀行为：合金 Sb 含量和金属间化合物类型的作用
Sn-Sb 焊料合金 (2; 5.5 和 10wt-% Sb) 被定向凝固，目的是允许大范围的凝固冷却速率的影响与所得的微观结构有关。
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