In the present study, in order to clarify the electrical and mechanical properties of the junction of superconducting wires, a junction was numerically simulated using the finite element method, and the electrical and mechanical properties were evaluated. We used a 1 µm-thick $\text{YB}{\mathrm{a}}_2\mathrm{C}{\mathrm{u}}_3{\mathrm{O}}_{7-\delta }$ superconducting coated conductor to act as a superconducting wire and joined two films together for current density simulation. The magnetic field dependence of the critical current density is based on the experimental results for $\text{YB}{\mathrm{a}}_2\mathrm{C}{\mathrm{u}}_3{\mathrm{O}}_{7-\delta }$. We introduced a crack in the superconducting junction and confirm that the critical current is drastically reduced by increasing the width of crack. We then attempted to reinforce the crack using solder and superconducting film. The effectiveness of reinforcement of I_c was clarified using very thin solder or a silver diffusion junction.

在本研究中，为了阐明超导线结的电气和机械性能，使用有限元方法对结进行了数值模拟，并对电气和机械性能进行了评估。我们使用了1 µm的厚度$\text{B}{\mathrm{一种}}_2\mathrm{C}{\mathrm{ü}}_3{\mathrm{Ø}}_{7-\delta }$超导电涂层导体充当超导线，并将两层薄膜连接在一起以进行电流密度模拟。临界电流密度与磁场的关系基于实验结果$\text{B}{\mathrm{一种}}_2\mathrm{C}{\mathrm{ü}}_3{\mathrm{Ø}}_{7-\delta }$。我们在超导结中引入了裂纹，并确认通过增加裂纹的宽度可以大大降低临界电流。然后，我们尝试使用焊料和超导膜来增强裂纹。使用非常薄的焊料或银扩散结可以阐明增强I _c的有效性。