Electrically conductive adhesives (ECAs) are widely used in electronics and silver-based ECA is one of the most typical representatives. In this work, a trinary silver-based filler strategy was proposed to achieve ECAs with high conductivity and low silver content, where silver fractal flowers (Ag-FWs) were used to set up the conductive framework and silver nanowires (Ag-NWs) and silver nanoflakes (Ag-NFs) were added to connect the separated domains and fill the small gaps, respectively. The ECAs reached a low electrical resistivity of 6.0 × 10⁻⁵ Ω cm and high adhesion strength of 13.5 MPa when the addition of Ag-FWs, Ag-NWs and Ag-NFs were 50 wt%, 7.5 wt% and 2.5 wt%, respectively, superior to those reported ECAs of 80 wt% silver loading. Besides, the ECA circuit fabricated by 3D printer demonstrated good electrical conductivity and resistance stability. The preparation idea of ECAs brings novel opportunities for the development of the electronic packaging industries.

导电胶（ECA）广泛用于电子产品，银基ECA是最典型的代表之一。在这项工作中，提出了一种三元银基填充剂策略，以实现具有高电导率和低银含量的ECA，其中使用银分形花（Ag-FWs）来建立导电骨架，并使用银纳米线（Ag-NWs）添加银纳米薄片（Ag-NFs）以连接分离的域并分别填充小间隙。ECA的电阻率低至6.0×10 ^-5当Ag-FW，Ag-NW和Ag-NF的添加量分别为50 wt％，7.5 wt％和2.5 wt％时，Ωcm和13.5 MPa的高附着强度，优于报道的80 wt％银负载的ECA。 。此外，由3D打印机制造的ECA电路具有良好的导电性和电阻稳定性。ECA的准备思想为电子包装行业的发展带来了新的机遇。