Abstract Malfunctioning caused by hotspots in high-power and high-density microelectronics has been a major problem, particularly for miniaturized advanced portable electronic devices. The use of efficient heat spreaders or cooling films is a viable solution for mitigating the hotspot concern in high-power density electronic devices. In this study, we fabricated thin, flexible, wearable, heat-spreading cooling films decorated with highly nanotextured Ni microfibers. The Ni-electroplated microfibers could quickly spread heat over a solid medium and dissipate heat to the atmosphere via convective cooling. In the present parametric studies, the Ni electroplating time varied from 45 to 60 and 90 min. The optimal condition, which yielded the lowest thermal resistance and the highest heat transfer coefficient, was identified. The Ni microfibers were characterized using scanning electron microscopy, X-ray diffraction, and transmission electron microscopy analyses.

中文翻译：

---

使用电镀镍纳米结构纤维的柔性散热和风冷薄膜

摘要 大功率和高密度微电子中热点引起的故障一直是一个主要问题，特别是对于小型化的先进便携式电子设备。使用高效的散热器或冷却膜是缓解高功率密度电子设备热点问题的可行解决方案。在这项研究中，我们制造了用高度纳米纹理的镍微纤维装饰的薄的、灵活的、可穿戴的、散热的冷却膜。电镀镍的微纤维可以在固体介质上快速传播热量，并通过对流冷却将热量散发到大气中。在目前的参数研究中，镍电镀时间从 45 到 60 和 90 分钟不等。确定了产生最低热阻和最高传热系数的最佳条件。