Micro ED milling is one of the widely applied processes to generate microfeatures on electrically conductive materials. However, the drawbacks associated with this process namely low MRR and high surface roughness limits its wide applicability. To enhance the rate of metal removal and surface finish an investigation is carried out by mixing SiC nano powders with dielectric media. Experimental trails were conducted at different settings of discharge energy and powder concentration to identify the optimum condition for responses namely MRR, R_a and Micro hardness. Full factorial design is used to design the experiments for both plain dielectric and powder mixed µEDM process. The morphology of milled surface with plain /nano powder mixed dielectric has also been analyzed. The findings revealed that the break down voltage of SiC nano powder mixed dielectric was 40% lower than plain dielectric media due to this enhancement in MRR and surface finish. Lower values of powder concentration (2 g/l) favors the MRR and surface finish but the higher value of powder concentration (6 g/l) favors the microhardness. Crater size, voids and cracks were reduced with SiC mixed dielectric than plain dielectric under considered settings of discharge energy due to increase in sparking area. Material removal efficiency is found to be high with medium range of discharge energy for both plain and SiC mixed dielectric used.

Micro ED铣削是在导电材料上生成微特征的广泛应用的工艺之一。但是，与该方法相关的缺点即低MRR和高表面粗糙度限制了其广泛的适用性。为了提高金属去除率和表面光洁度，通过将SiC纳米粉末与电介质混合来进行研究。在放电能量和粉末浓度的不同设置下进行了实验跟踪，以确定响应的最佳条件，即MRR，R _a和显微硬度。全因子设计用于设计普通电介质和粉末混合µEDM工艺的实验。还分析了普通/纳米粉末混合电介质铣削表面的形貌。研究发现，由于MRR和表面光洁度的提高，SiC纳米粉末混合电介质的击穿电压比普通电介质低40％。较低的粉末浓度（2 g / l）值有利于MRR和表面光洁度，而较高的粉末浓度（6 g / l）值有利于显微硬度。在考虑的放电能量设置下，由于火花面积的增加，与普通电介质相比，SiC混合电介质减少了火山口的尺寸，空隙和裂纹。