Abstract In this work, the effect of substituting Cu with small amounts of Sn and Si on the passive behavior and pitting resistance of the bulk metallic glass Ti40Zr10Cu36Pd14 was investigated. The Sn/Si substitution promoted homogenization of the solid solution and limited the presence of casting defects. In addition, unlike the heterogeneous passive film grown on TiZrCuPd, the passive films of the micro-alloyed materials were homogeneous, implying less sensitivity to film weakening and breakdown. Thus, alloying with small amounts of Sn and Si appears to be a viable approach to drastically improve the corrosion resistance of TiZrCuPd.

中文翻译：

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合金元素对TiZr基块状金属玻璃组织和腐蚀行为的影响

摘要 在这项工作中，研究了用少量的锡和硅代替铜对大块金属玻璃Ti40Zr10Cu36Pd14 的钝化行为和抗点蚀性能的影响。Sn/Si 取代促进了固溶体的均匀化并限制了铸造缺陷的存在。此外，与在 TiZrCuPd 上生长的异质钝化膜不同，微合金材料的钝化膜是均质的，这意味着对膜弱化和击穿的敏感性较低。因此，与少量 Sn 和 Si 合金化似乎是显着提高 TiZrCuPd 耐腐蚀性的可行方法。