Manganese-doped tetrahedrites, with Cu₁₁Mn₁Sb₄S₁₃ composition and synthesized by the solid-state method, were hot-pressed at temperatures ranging between 788 K and 848 K. The structure, microstructure, phase purity and thermoelectric properties of the materials were characterized by x-ray diffraction (XRD), scanning electron microscopy (SEM), energy-dispersive spectroscopy (EDS) and density studies. According to the XRD analysis, all the hot-pressed materials presented a main tetrahedrite phase. However, very small amounts of chalcostibite (CuSbS₂) were detected by SEM–EDS. While keeping the pressure constant at 60 MPa, an increase in density with hot-pressing temperature was observed, reaching a maximum relative density of 97% for the samples hot-pressed at 848 K. Measurements of the electrical transport properties indicated higher thermal conductivity, electrical conductivity and Seebeck coefficient for the denser samples, with a greater power factor leading to an increase of > 10% in the figure of merit (\(zT\)) relative to the less dense materials.

在788 K和848 K之间的温度下热压固相合成的组成为Cu ₁₁ Mn ₁ Sb ₄ S ₁₃的掺锰四面体。通过X射线衍射（XRD），扫描电子显微镜（SEM），能量色散光谱（EDS）和密度研究对材料进行了表征。根据XRD分析，所有热压材料均呈现主四面体相。但是，少量的黄铜矿（CuSbS ₂）由SEM-EDS检测。在将压力恒定保持在60 MPa的同时，观察到密度随热压温度的增加而增加，对于在848 K下热压的样品，最大相对密度达到97％。电传输性能的测量表明，热导率更高，密度较高的样品的电导率和塞贝克系数，相对于密度较低的材料，功率因数较高，导致品质因数（\（zT \））的增加> 10％。