Abstract In this study, the hot compression bonding (HCB) tests of 2196 Al-Cu-Li alloy were carried out under different temperatures, strain rates and strains. The interfacial microstructure evolution and bonding mechanism were investigated in detail. The effects of deformation parameters on the bonding quality were revealed, and the processing window for HCB was determined. The preconditions of realizing interfacial bonding are the discontinuous dynamic recrystallization (dDRX) induced by grain boundary bulging or particle-stimulated nucleation (PSN), and the subsequent migration of interface grain boundary (IGB). As strain increases, the bonding quality is improved significantly. The elevated interfacial pressure and quick dDRX behavior under high strain rate are also favorable for bonding. The optimal processing window for HCB was determined as temperatures ranging from 470 to 525 °C and strain rates of 0.6 to 1 s−1. An expression of activation energy (Qw) for HCB was proposed to quantitatively evaluate the combined effects of strain, bonding time and interfacial pressure on the bonding quality. It was found that the strength of most bonding joints can be more than 80% of strength of the base material when the Qw is larger than 1.2.

中文翻译：

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2196铝铜锂合金热压缩变形结合机理及力学性能

摘要 本研究对2196 Al-Cu-Li合金在不同温度、应变速率和应变下进行了热压结合(HCB)试验。详细研究了界面微观结构演变和结合机制。揭示了变形参数对接合质量的影响，并确定了 HCB 的加工窗口。实现界面结合的前提是由晶界膨胀或粒子刺激成核（PSN）引起的不连续动态再结晶（dDRX），以及随后的界面晶界迁移（IGB）。随着应变的增加，接合质量显着提高。在高应变率下升高的界面压力和快速的 dDRX 行为也有利于键合。HCB 的最佳加工窗口确定为温度范围为 470 至 525 °C，应变速率为 0.6 至 1 s-1。提出了 HCB 的活化能 (Qw) 表达式，以定量评估应变、键合时间和界面压力对键合质量的综合影响。发现当Qw大于1.2时，大多数接合点的强度可以达到基材强度的80%以上。