The forming process of thermoplastic composites inevitably leads to the development of residual stresses. This study proposes a model to predict the residual stresses at the ply scale of a thermoplastic composite laminate. It accounts for the heat transfer, crystallization kinetics and mechanical behaviour of the laminate. The model is applied to the cooling of a polyamide 66 (PA66) matrix reinforced with continuous glass fibres. The Stress Free Temperature is considered as the starting point of stresses accumulation within each ply and its identification is discussed. The curvatures of [90₄/0₄] laminates and their evolution with temperature are recorded with a digital image correlation technique. They are compared to the curvatures predicted by the model, which permits to validate it. The predicted stresses distribution is then discussed. Finally, the model is compared to the Classical Lamination Theory, demonstrating the interest of the developed model.

热塑性复合材料的成型过程不可避免地导致残余应力的发展。这项研究提出了一个模型来预测热塑性复合材料层压板的层级残余应力。它说明了层压板的传热，结晶动力学和机械性能。该模型适用于用连续玻璃纤维增​​强的聚酰胺66（PA66）基体的冷却。无应力温度被认为是每个层中应力积累的起点，并讨论了其识别方法。的[90曲率₄ /0 ₄用数字图像相关技术记录层压板及其随温度的变化。将它们与模型预测的曲率进行比较，从而可以对其进行验证。然后讨论了预测的应力分布。最后，将模型与古典层压理论进行比较，证明了所开发模型的重要性。