Objective

To evaluate edge chip resistance (R_eA) and fractographic features of ceramic systems submitted to edge chipping.

Methods

Samples were fabricated using the following materials: YZ-yttria-stabilized tetragonal zirconia ceramic (IPS e.max® Zir-CAD); LG-leucite-reinforced glass-ceramic (IPS Empress® CAD); LD-lithium-disilicate glass-ceramic (IPS e.max® CAD); ZF- YZ veneered by a pressable fluorapatite glass-ceramic (IPS e.max® Zir-CAD + IPS e.max® Zir-Press); ZD- YZ-LD fused together by a glass-ceramic (IPS e.max® Zir-CAD + IPS e.max® crystall./connect + IPS e.max® CAD). Half of the sample size was bonded (B) to a dentine analogue substrate (NEMA G10) and the remaining samples were kept non-bonded (NB). Structures were indented (n = 25) at different edge distances (d = 0.3, 0.4, 0.5, 0.6, 0.7 mm) using a universal testing machine to produce chips. Force (F) and d values were recorded and R_eA was calculated. Data were statistically analyzed using ANOVA, Student t and Tukey tests (α = 0.05). Chipping was evaluated visually and under optical and scanning electron microscopy based on fractography principles.

Results

Data (F vs d) showed a positive linear trend for all groups. There was no significant difference in R_eA values at d = 0.5 mm (S_E0.5) between NB and B for same ceramic system. Fracture pattern was similar between NB and B for same ceramic system at d = 0.5 mm.

Conclusions

Bonding neither influenced R_eA values nor the fracture pattern that were similar between NB and B structures from same ceramic system. The greater the distance from structure edge, the lesser the chance of chipping occurred.

中文翻译：

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陶瓷碎屑的定量和定性分析。

目的

评估边缘系统的边缘抗_碎性（R _eA）和陶瓷系统的分形特征。

方法

样品使用以下材料制造：YZ -yttria稳定四方晶氧化锆陶瓷（IPSe.max®ZIR-CAD）; LG白云石增强玻璃陶瓷（IPSEmpress®CAD）；LD-二硅酸锂玻璃陶瓷（IPSe.max®CAD）; ZF -YZ由可压缩的氟磷灰石玻璃陶瓷（IPSe.max®Zir-CAD + IPSe.max®Zir-Press）贴面; ZD -YZ-LD通过玻璃陶瓷融合在一起（IPSe.max®Zir-CAD + IPSe.max®结晶/连接 + IPSe.max®CAD）。将一半样品尺寸粘合（B）到牙本质类似物基质（NEMA G10）上，其余样品保持未粘合（NB）。使用通用测试机在不同的边缘距离（d = 0.3、0.4、0.5、0.6、0.7毫米）上对结构进行压痕（n = 25）。记录力（F）和d值，并计算R _eA。使用方差分析，Student t和Tukey检验对数据进行统计分析（α= 0.05）。目测碎片，并在光学和扫描电子显微镜下根据断层摄影原理进行评估。

结果

数据（F vs d）显示所有组的正线性趋势。对于同一陶瓷系统，NB和B在d = 0.5 mm（S _E 0.5）时，R _eA值无显着差异。对于相同的陶瓷系统，在d = 0.5 mm时，NB和B之间的断裂模式相似。

结论

键合既不会影响R _eA值，也不会影响相同陶瓷体系的NB和B结构之间的断裂模式。与结构边缘的距离越大，碎裂的机会就越小。