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Quantitative and qualitative analyses of ceramic chipping.
Journal of the Mechanical Behavior of Biomedical Materials ( IF 3.3 ) Pub Date : 2020-07-03 , DOI: 10.1016/j.jmbbm.2020.103928
Suzane Boa Nova Brandeburski 1 , Alvaro Della Bona 1
Affiliation  

Objective

To evaluate edge chip resistance (ReA) and fractographic features of ceramic systems submitted to edge chipping.

Methods

Samples were fabricated using the following materials: YZ-yttria-stabilized tetragonal zirconia ceramic (IPS e.max® Zir-CAD); LG-leucite-reinforced glass-ceramic (IPS Empress® CAD); LD-lithium-disilicate glass-ceramic (IPS e.max® CAD); ZF- YZ veneered by a pressable fluorapatite glass-ceramic (IPS e.max® Zir-CAD + IPS e.max® Zir-Press); ZD- YZ-LD fused together by a glass-ceramic (IPS e.max® Zir-CAD + IPS e.max® crystall./connect + IPS e.max® CAD). Half of the sample size was bonded (B) to a dentine analogue substrate (NEMA G10) and the remaining samples were kept non-bonded (NB). Structures were indented (n = 25) at different edge distances (d = 0.3, 0.4, 0.5, 0.6, 0.7 mm) using a universal testing machine to produce chips. Force (F) and d values were recorded and ReA was calculated. Data were statistically analyzed using ANOVA, Student t and Tukey tests (α = 0.05). Chipping was evaluated visually and under optical and scanning electron microscopy based on fractography principles.

Results

Data (F vs d) showed a positive linear trend for all groups. There was no significant difference in ReA values at d = 0.5 mm (SE0.5) between NB and B for same ceramic system. Fracture pattern was similar between NB and B for same ceramic system at d = 0.5 mm.

Conclusions

Bonding neither influenced ReA values nor the fracture pattern that were similar between NB and B structures from same ceramic system. The greater the distance from structure edge, the lesser the chance of chipping occurred.



中文翻译:

陶瓷碎屑的定量和定性分析。

目的

评估边缘系统的边缘抗性(R eA)和陶瓷系统的分形特征。

方法

样品使用以下材料制造:YZ -yttria稳定四方晶氧化锆陶瓷(IPSe.max®ZIR-CAD); LG白云石增强玻璃陶瓷(IPSEmpress®CAD);LD-二硅酸锂玻璃陶瓷(IPSe.max®CAD); ZF -YZ由可压缩的氟磷灰石玻璃陶瓷(IPSe.max®Zir-CAD + IPSe.max®Zir-Press)贴面; ZD -YZ-LD通过玻璃陶瓷融合在一起(IPSe.max®Zir-CAD + IPSe.max®结晶/连接 + IPSe.max®CAD)。将一半样品尺寸粘合(B)到牙本质类似物基质(NEMA G10)上,其余样品保持未粘合(NB)。使用通用测试机在不同的边缘距离(d = 0.3、0.4、0.5、0.6、0.7毫米)上对结构进行压痕(n = 25)。记录力(F)和d值,并计算R eA。使用方差分析,Student t和Tukey检验对数据进行统计分析(α= 0.05)。目测碎片,并在光学和扫描电子显微镜下根据断层摄影原理进行评估。

结果

数据(F vs d)显示所有组的正线性趋势。对于同一陶瓷系统,NB和B在d = 0.5 mm(S E 0.5)时,R eA值无显着差异。对于相同的陶瓷系统,在d = 0.5 mm时,NB和B之间的断裂模式相似。

结论

键合既不会影响R eA值,也不会影响相同陶瓷体系的NB和B结构之间的断裂模式。与结构边缘的距离越大,碎裂的机会就越小。

更新日期:2020-07-03
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