Abstract Diamond/copper composite has excellent thermal conductivity, which is expected to solve the problem of heat dissipation in high heat flux situation in the future. In this study, the research progress of diamond/copper composite materials is summarized, including the theoretical model, preparation process and preliminary application. Molding technology, composition parameters, interface thickness, interface modification methods and the choice of active elements, the guiding factors of high thermal conductivity in the existing research are analyzed. The modification of the theoretical model, the improvement of the interface modification, the high heat conduction channel brought by the agglomeration of diamond and the near net forming technology are proposed as the future research focus in this field, which provides guidance for the future research.

中文翻译：

---

高导热金刚石/铜复合材料的研究进展

摘要 金刚石/铜复合材料具有优良的导热性，有望解决未来高热通量情况下的散热问题。本研究综述了金刚石/铜复合材料的研究进展，包括理论模型、制备工艺和初步应用。分析了成型工艺、成分参数、界面厚度、界面改性方法和活性元素的选择，以及现有研究中高导热率的指导因素。理论模型的修正、界面改性的改进、金刚石团聚带来的高导热通道和近净成形技术被提出作为该领域未来的研究重点，