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Effect of Molding Temperature on Shape Memory Performance of SMPC
Integrated Ferroelectrics ( IF 0.7 ) Pub Date : 2020-07-01 , DOI: 10.1080/10584587.2020.1728804
Yuqin Ma 1 , Jie Wang 1 , Shuangshuang Li 1 , Juan Ma 1 , Yatao Zhao 1 , Wei Xu 1
Affiliation  

Abstract Carbon fiber reinforced shape memory polymer composite (SMPC) is a kind of smart material with shape memory characteristics, which is widely used in aerospace, biomedicine, robotics and other fields. In this paper, SMPC was prepared by heating molding process at five different molding temperatures. The effect of molding temperature on the shape memory performance of SMPC was studied. The results show that the shape memory properties of SMPC are closely related to the infiltration effect during the preparation process. When the molding temperature is 70 °C, SMPC has an optimum penetration effect and the preparation defects are effectively controlled. The shape fixing rate is 84.3%, and the shape recovery rate is 94.7%, which lays a foundation for the better application of shape memory composite.

中文翻译:

成型温度对 SMPC 形状记忆性能的影响

摘要 碳纤维增强形状记忆聚合物复合材料(SMPC)是一种具有形状记忆特性的智能材料,广泛应用于航空航天、生物医学、机器人等领域。在本文中,SMPC 是通过在五种不同的成型温度下加热成型工艺制备的。研究了成型温度对SMPC形状记忆性能的影响。结果表明,SMPC的形状记忆特性与制备过程中的渗透效果密切相关。当成型温度为70℃时,SMPC具有最佳的渗透效果,制备缺陷得到有效控制。形状固定率为84.3%,形状恢复率为94.7%,为形状记忆复合材料的更好应用奠定了基础。
更新日期:2020-07-01
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