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Fabrication of Cu/Nafion-Based Ionic Polymer Metal Composites by Electroless Plating Method
Integrated Ferroelectrics ( IF 0.7 ) Pub Date : 2020-07-01 , DOI: 10.1080/10584587.2020.1728809
Liang Yang 1 , Dongsheng Zhang 1 , Xining Zhang 1 , Aifen Tian 2 , Xuan Hui 2 , Jing Yang 2
Affiliation  

Abstract The Cu/Nafion-based ionic polymer metal composites were analyzed in terms morphology, proton conductivity, water loss, displacement and blocking force performance were examined. The SEM images revealed that Cu particles distribution is uniform and compact on the surface of Nafion membrane due to continuous heterogeneous nucleation and grain growth. The IPMC is composed of the ionomer membrane layer, the middle layer and the surface electrode layer. A less water restricts the migration of the hydrated cation transfer, and causes the migration barrier, resulting in reducing conductivity of the IPMCs. The maximum displacement and maximum force are 30 mm and 9.1 mN.

中文翻译:

化学镀法制备Cu/Nafion基离子聚合物金属复合材料

摘要 对Cu/Nafion基离子聚合物金属复合材料的形貌、质子电导率、失水、位移和阻断力等性能进行了分析。SEM 图像显示,由于连续的异质成核和晶粒生长,Cu 颗粒在 Nafion 膜表面分布均匀且致密。IPMC由离聚物膜层、中间层和表面电极层组成。较少的水会限制水合阳离子转移的迁移,并导致迁移障碍,导致 IPMC 的电导率降低。最大位移和最大力为 30 mm 和 9.1 mN。
更新日期:2020-07-01
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