Abstract In this study, Ni foam, Cu coated Ni foam and Cu-Ni alloy foams were used as strengthening phases for pure Sn solder. Cu-Cu joints were fabricated by soldering with these Sn-based composite solders at 260 °C for different times. The tensile strength of pure Sn solder was improved significantly by the addition of metal foams, and the Cu-Ni alloy/Sn composite solder exhibited the highest tensile strength of 50.32 MPa. The skeleton networks of the foams were gradually dissolved into the soldering seam with increasing soldering time, accompanied by the massive formation of (Cu,Ni)6Sn5 phase in the joint. The dissolution rates of Ni foam, Cu coated Ni foam and Cu-Ni alloy foams into the Sn matrix increased successively during soldering. An increased dissolution rate of the metal foam leads to an increase in the Ni content in the soldering seam, which was found to be beneficial in refining the (Cu,Ni)6Sn5 phase and inhibiting the formation of the Cu3Sn IMC layer on the Cu substrate surface. The average shear strength of the Cu joints was improved with increasing soldering time, and a shear strength of 61.2 MPa was obtained for Cu joints soldered with Cu-Ni alloy/Sn composite solder for 60 min.

中文翻译：

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用泡沫金属增强的锡基复合焊料焊接的铜接头的微观结构和机械性能

摘要 本研究采用泡沫镍、镀铜泡沫镍和泡沫铜镍合金作为纯锡焊料的强化相。通过在 260 °C 下用这些 Sn 基复合焊料焊接不同时间来制造 Cu-Cu 接头。加入泡沫金属后，纯Sn焊料的抗拉强度显着提高，Cu-Ni合金/Sn复合焊料的抗拉强度最高，达到50.32 MPa。随着焊接时间的增加，泡沫的骨架网络逐渐溶解到焊缝中，同时在接头中大量形成 (Cu,Ni)6Sn5 相。在焊接过程中，泡沫镍、镀铜泡沫镍和泡沫铜镍合金在锡基体中的溶解速率依次增加。金属泡沫溶解速率的增加导致焊缝中镍含量的增加，这被发现有利于细化 (Cu,Ni)6Sn5 相并抑制 Cu3Sn IMC 层在 Cu 基板表面上的形成。Cu接头的平均剪切强度随着焊接时间的增加而提高，使用Cu-Ni合金/Sn复合焊料焊接60分钟的Cu接头获得61.2 MPa的剪切强度。