The rapid increase in the number of cores on chips forced the designers to invent new communication methods such as Network-on-Chip (NoC) paradigm. Advances in integrated circuit fabrications even allowed three-dimensional NoC (3D-NoC) implementations. 3D-NoCs have more advantages than their 2D counterparts such as lower area, higher throughput, better performance, and less energy consumption. However, they lack the design automation algorithms. An important design problem for a given application is mapping it on a 3D-NoC topology. In this paper, we present an integer linear programming (ILP) formulation and a novel heuristic algorithm, called CastNet3D, for application mapping onto mesh-based 3D-NoCs with energy minimization being the objective. The algorithm tries to utilize vertical links for communicating nodes as much as possible. Vertical links are shorter than horizontal ones; therefore, they are faster and consume less energy. We compared CastNet3D against ILP in terms of energy consumption and execution time on several benchmarks. Our results show that CastNet3D obtains close to optimum results in much shorter time frames.

中文翻译：

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在 3D-NoC 上进行能量感知应用映射的 ILP 公式和启发式方法

芯片上内核数量的快速增加迫使设计人员发明新的通信方法，例如片上网络 (NoC) 范式。集成电路制造的进步甚至允许实现三维 NoC (3D-NoC)。3D-NoC 比 2D 同类具有更多优势，例如面积更小、吞吐量更高、性能更好和能耗更低。然而，他们缺乏设计自动化算法。给定应用的一个重要设计问题是将其映射到 3D-NoC 拓扑上。在本文中，我们提出了一种整数线性规划 (ILP) 公式和一种称为 CastNet3D 的新型启发式算法，用于将应用程序映射到基于网格的 3D-NoC，目标是能量最小化。该算法尝试尽可能多地利用垂直链接来通信节点。垂直链接比水平链接短；因此，它们速度更快，消耗的能量更少。我们在几个基准测试中将 CastNet3D 与 ILP 在能耗和执行时间方面进行了比较。我们的结果表明 CastNet3D 在更短的时间范围内获得了接近最佳的结果。