In this brief, a cobweb-based redundant through-silicon-via (TSV) design is proposed with efficient hardware as well as high repair rate to repair clustered faulty TSVs (FTSVs). The experimental simulation results demonstrate that for highly clustered faults, the repair rate of the proposed RTSV method is 48.59% and 1.75% higher than that of the ring-based and router-based RTSV methods, respectively. Furthermore, the proposed design can achieve 63.93% and 16.34% hardware reductions compared with the router-based and the ring-based design, respectively.

中文翻译：

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用于集群故障的基于蛛网的冗余TSV架构

在本简报中，提出了一种基于蜘蛛网的冗余硅通孔 (TSV) 设计，该设计具有高效的硬件和高修复率，以修复集群故障 TSV (FTSV)。实验仿真结果表明，对于高度聚类的故障，所提出的RTSV方法的修复率分别比基于环和基于路由器的RTSV方法高48.59%和1.75%。此外，与基于路由器和基于环的设计相比，所提出的设计可以分别实现 63.93% 和 16.34% 的硬件减少。