Through-glass-via based X-band microstrip band-pass filters are wafer-level fabricated by casting molten zinc-aluminum alloy into micromachined glass substrate. Instead of using time-consuming electroplating to form a via based GHz microstrip filter, where seed-layer deposition, plating and seed-layer removal process cycle should be repeated for several times, herein the metal parts of filter, including the resonators, the large-area ground and the metal plug in through-glass-via are all formed in one-step liquid-alloy filling in the pre-micromachined mold within only 5min for a whole wafer. This process is much quicker and simpler compared to those electroplating based approaches for microstrip filters. The micro-casting fabricated filter has a center frequency of 8.6GHz with 800MHz bandwidth. The measured insertion loss is −2.1dB, and the return loss is lower than −10dB within the passband. Good agreement is achieved between the measured results and the simulated ones. This technique can also be widely used for fabricating various RF devices.

中文翻译：

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用晶圆级低熔点合金微铸件制造的基于玻璃通孔的微带带通滤波器

基于玻璃通孔的 X 波段微带带通滤波器是通过将熔融锌铝合金浇铸到微加工玻璃基板上而制成的晶圆级。而不是使用耗时的电镀来形成基于过孔的 GHz 微带滤波器，其中种子层沉积、电镀和种子层去除过程循环应重复多次，这里过滤器的金属部分，包括谐振器，大- 区域接地和玻璃通孔中的金属插塞都是通过一步液态合金填充在预微加工模具中形成的，整个晶片仅需 5 分钟。与微带滤波器的那些基于电镀的方法相比，这个过程要快得多，也更简单。微铸成型滤波器的中心频率为8.6GHz，带宽为800MHz。测得的插入损耗为−2.1dB，并且在通带内回波损耗低于-10dB。实测结果与模拟结果吻合良好。该技术还可广泛用于制造各种射频器件。